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FINGERPRINT IDENTIFICATION MODULE

  • US 20170323144A1
  • Filed: 07/27/2017
  • Published: 11/09/2017
  • Est. Priority Date: 07/09/2015
  • Status: Active Grant
First Claim
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1. A fingerprint identification module, comprising:

  • a cover plate, having an inner surface, an outer surface opposite to the inner surface, and a plurality of microstructures located at the inner surface;

    a fingerprint identification sensor, located under the microstructures;

    a first adhesive layer, wherein the fingerprint identification sensor is attached to the microstructures through the first adhesive layer, the first adhesive layer is adhered between a portion of the microstructures and a portion of the fingerprint identification sensor, and an air gap is located between the other portion of the microstructures and the other portion of the fingerprint identification sensor; and

    at least one light source, located under the inner surface and adjacent to the fingerprint identification sensor.

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