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HETEROGENEOUS INTEGRATION USING WAFER-TO-WAFER STACKING WITH DIE SIZE ADJUSTMENT

  • US 20170323920A1
  • Filed: 07/21/2017
  • Published: 11/09/2017
  • Est. Priority Date: 05/06/2016
  • Status: Active Grant
First Claim
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1. A method for three-dimensional wafer scale integration of heterogeneous wafers with unequal die sizes that include a first wafer and a second wafer, the method comprising:

  • selecting a periodicity for the second wafer to be manufactured that matches the periodicity of the first wafer;

    manufacturing the second wafer in accordance with the selected periodicity;

    placing, by a laser-based patterning device, a pattern in spaces between dies of the second wafer; and

    stacking the first wafer onto the second wafer, using a copper-to-copper bonding process to bond the first wafer to the second wafer.

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