×

METHOD OF LASER PROCESSING A COMPONENT WITHIN AN ASSEMBLED APPARATUS USING A BOROSCOPE

  • US 20170326685A1
  • Filed: 07/20/2017
  • Published: 11/16/2017
  • Est. Priority Date: 09/19/2012
  • Status: Active Grant
First Claim
Patent Images

1. A method of laser processing a component within an assembled apparatus, the apparatus comprising a casing enclosing the component, the casing having at least one aperture extending there-through, the method comprising:

  • a) inserting a boroscope through the aperture, the boroscope comprising a working head, the working head having a first end and a second end, a first optical fiber extending through the boroscope to a position between the first end and the second end of the working head, a second optical fiber extending through the boroscope to the second end of the working head, a laser optical fiber extending through the boroscope, a mirror adjustably mounted on the working head, the laser optical fiber being arranged to direct laser light transmitted through the laser optical fiber onto the mirror on the working head, a first light source arranged at a position between the first end and the second end of the working head, a second light source arranged at the second end of the working head and an actuator device to adjust the position of the mirror,b) viewing the assembled apparatus within the casing using the second optical fiber,c) viewing the assembled apparatus within the casing using the second optical fiber while moving the working head of the boroscope to the component,d) transmitting a laser beam through the laser optical fiber to the mirror,e) reflecting the laser beam off the mirror onto a surface of the component to process the surface of the component, andf) viewing the surface of the component and the laser beam with the first optical fiber to monitor the processing of the surface of the component.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×