SUBSTRATE AND TERMINALS FOR POWER MODULE AND POWER MODULE INCLUDING THE SAME

• US 20170331209A1
• Filed: 08/02/2017
• Published: 11/16/2017
• Est. Priority Date: 02/07/2013
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: KIM, Che-heung, KIM, Chang-sik, BOOH, Seong-woon
• Granted Patent: US 10,193,250 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01R 12/7088 Arrangements for power supply
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

According to example embodiments, a substrate for a power module includes first to third parts spaced apart from each other, where the third part surrounds the first and second parts, and a conductive layer on the first to third parts. A terminal of a first polarity is connected to the first part, and a terminal of a second polarity is connected to the second part. The first and second terminals may be spaced apart from each other and each have a coupling part, a body, and a contact part. The bodies of the first and second terminals may overlap each other. A power module may include the substrate.

Claims

1. A substrate for a power module, comprising:

first to third parts on a same surface of an underlying part of the substrate,

wherein the first to third parts are spaced apart from each other, electrically insulated from each other, and not directly contacting each other,

wherein the third part surrounds the first and second parts,

a first element module is on the third part, and

all of the first to third parts are conductive.

3. The substrate for a power module of claim 1, further comprising:

a second element module is on one of the first and second parts.

5. The substrate for a power module of claim 1, wherein the third part comprises a control pin installation region and an output terminal installation region.

7. The substrate for a power module of claim 1, wherein the first and second parts are parallel with each other, and the first and second parts have no protruding parts.

2. (canceled)

4. (canceled)

6. (canceled)

8-20. -20. (canceled)