PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
First Claim
1. A package structure, comprisinga device chip;
- a MEMS die over the device chip, the MEMS die comprising;
a substrate having a plurality of cavities; and
a conductive layer covering a bottom surface and sidewalls of each of the cavities;
a cap structure coupled to the MEMS die, the cap structure comprising;
a base substrate having at least one seal ring, wherein the seal ring is located in the cavities; and
a bonding layer covering a first surface and at least part of sidewalls of the seal ring, wherein the first surface of the seal ring faces the MEMS die; and
an eutectic bonding layer located between the conductive layer and the bonding layer in the cavities.
1 Assignment
0 Petitions
Accused Products
Abstract
A package structure includes a device chip, a MEMS die, a cap structure, and an eutectic bonding layer. The MEMS die is over the device chip and includes a substrate having a plurality of cavities and a conductive layer covering a bottom surface and sidewalls of each of the cavities. The cap structure is coupled to the MEMS die, and the cap structure includes a base substrate having at least one seal ring located in the cavities and a bonding layer covering a first surface and at least part of sidewalls of the seal ring. The first surface of the seal ring faces the MEMS die. The eutectic bonding layer is located between the conductive layer and the bonding layer in the cavities. In addition, a method of manufacturing the package structure is provided.
-
Citations
20 Claims
-
1. A package structure, comprising
a device chip; -
a MEMS die over the device chip, the MEMS die comprising; a substrate having a plurality of cavities; and a conductive layer covering a bottom surface and sidewalls of each of the cavities; a cap structure coupled to the MEMS die, the cap structure comprising; a base substrate having at least one seal ring, wherein the seal ring is located in the cavities; and a bonding layer covering a first surface and at least part of sidewalls of the seal ring, wherein the first surface of the seal ring faces the MEMS die; and an eutectic bonding layer located between the conductive layer and the bonding layer in the cavities. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A package structure, comprising
a device chip; -
a MEMS die disposed over and electrically connected to the device chip, the MEMS die comprising; a substrate having a plurality of cavities; and a conductive layer disposed within and conformally covering each of the cavities; a cap structure disposed on and coupled to the MEMS die, the cap structure comprising; a base substrate having a plurality of first protrusions and a plurality of second protrusions, the second protrusions are located between two adjacent first protrusions, each of the first protrusions comprises a first portion and a second portion, the second portion connects the first portion and the base substrate, and the first portion is inserted into the corresponding cavity; and a bonding layer covering the first portion; and an eutectic bonding layer located between the conductive layer and the boding layer in the cavities. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
-
-
17. A method of manufacturing a package structure, comprising:
-
providing a device wafer; providing a MEMS wafer over the device wafer; bonding the MEMS wafer with the device wafer; forming a plurality of cavities in a substrate of the MEMS wafer and forming a conductive layer over the substrate of the MEMS wafer and in the cavities; providing a cap wafer; forming a plurality of seal rings in the cap wafer and forming a bonding layer partially covering the plurality of seal rings; bonding the plurality of seal rings of the cap wafer with the plurality of cavities of the MEMS wafer through eutectic bonding of the bonding layer on the plurality of seal rings and the conductive layer within the plurality of cavities; and dicing the device wafer, the MEMS wafer, and the cap wafer to form a package structure. - View Dependent Claims (18, 19, 20)
-
Specification