Transferring Method, Manufacturing Method, Device and Electronic Apparatus of Micro-LED

• US 20170338374A1
• Filed: 05/21/2015
• Published: 11/23/2017
• Est. Priority Date: 05/21/2015
• Status: Active Grant

• Current Assignee: Goertek Incorporated
• Original Assignee: Goertek Incorporated
• Inventors: Zou, Quanbo, Wang, Zhe
• Granted Patent: US 10,193,012 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/81005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/00 Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/52 : Encapsulations
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED (402) are disclosed. The method for transferring micro-LED (402) comprises: transferring at least one micro-LED (402) from an original substrate (406) to a support body (412); transferring the at least one micro-LED (402) from the support body (412) to a backup substrate (415); and transferring the at least one micro-LED (402) from the backup substrate (415) to a receiving substrate (417).

Claims

1. A method for transferring micro-LED, comprising:

transferring at least one micro-LED from an original substrate to a support body;

transferring the at least one micro-LED from the support body to a backup substrate; and

transferring the at least one micro-LED from the backup substrate to a receiving substrate.

2. The method according to claim 1, wherein the original substrate is laser-transparent, and the step of transferring at least one micro-LED from an original substrate to a support body comprises:

mounting the original substrate onto the support body, wherein the micro-LEDs are formed on the original substrate, the support body has light-release adhesive on its surface, and the micro-LEDs are adhered to the support body via the light-release adhesive,

irradiating the original substrate with laser from the original substrate side, for lifting-off the at least one micro-LED from the original substrate, and

irradiating light from the support body side, to release un-lifted-off micro-LEDs;

wherein, the step of transferring the at least one micro-LED from the support body to a backup substrate comprises;

bonding the support body with the at least one micro-LED to the backup substrate, and

irradiating light from the support body side, to release the at least one micro-LED.

3. The method according to claim 2, wherein the light-release adhesive is a UV tape, and the support body is stiff.

4. The method according to claim 2, wherein the material of the support body is PET.

5. The method according to claim 1 or 2, wherein the backup substrate has elastomer or polymer on its surface, and the step of transferring the at least one micro-LED from the support body to a backup substrate further comprises:

bonding the at least one micro-LED to the backup substrate through the elastomer or polymer;

wherein the step of transferring the at least one micro-LED from the backup substrate to a receiving substrate further comprises;

aligning the at least one micro-LED with the pads on the receiving substrate; and

lifting-off the at least one micro-LED via the elastomer or polymer.

6. The method according to claim 1, further comprising:

forming red micro-LEDs on a growth substrate;

transferring the red micro-LEDs to an intermediate substrate; and

transferring the red micro-LEDs from the intermediate substrate to an original substrate.

7. The method according to claim 1, further comprising:

coating polymer on the receiving substrate with micro-LEDs;

curing the polymer;

etching the polymer, to expose the epitaxial layers of the micro-LEDs;

forming N-metal electrodes on the epitaxial layers of the micro-LEDs; and

performing encapsulation on the N-metal electrodes.

8. A method for manufacturing a micro-LED device, comprising transferring micro-LEDs to a receiving substrate by using the method according to claim 1.

9. A micro-LED device, which is manufactured by using the method according to claim 8.

10. An electronic apparatus, containing a micro-LED device according to claim 9.