LIGHT-EMITTING DIODE AND A METHOD FOR MANUFACTURING THE SAME
First Claim
1. A method for manufacturing a light-emitting diode (LED), comprising:
- providing a LED wafer comprising a substrate and a plurality of light-emitting units formed thereon;
removing at least a portion of the substrate;
fixing the LED wafer on an extensible membrane, wherein the light-emitting unit faces the extensible membrane;
breaking the LED wafer to form a plurality of LED dices separated from each other, wherein each LED dice comprises at least one light-emitting unit; and
expanding the extensible membrane to make a distance between any two of the LED dices become larger.
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Accused Products
Abstract
A method for manufacturing a light-emitting diode (LED) is provided. The method includes following steps. A LED wafer including a substrate and a plurality of light-emitting units formed thereon is provided. At least a portion of the substrate is removed. The LED wafer is fixed on an extensible membrane, wherein the light-emitting unit faces the extensible membrane. The LED wafer is broken to form a plurality of LED dices separated from each other, wherein each LED dice includes at least one light-emitting unit. The extensible membrane is expanded to make a distance between any two of the LED dices become larger.
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Citations
9 Claims
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1. A method for manufacturing a light-emitting diode (LED), comprising:
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providing a LED wafer comprising a substrate and a plurality of light-emitting units formed thereon; removing at least a portion of the substrate; fixing the LED wafer on an extensible membrane, wherein the light-emitting unit faces the extensible membrane; breaking the LED wafer to form a plurality of LED dices separated from each other, wherein each LED dice comprises at least one light-emitting unit; and expanding the extensible membrane to make a distance between any two of the LED dices become larger. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A manufacturing method of light-emitting diode (LED), comprising:
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providing an LED wafer comprising a substrate and a light-emitting unit formed on the substrate; removing at least a portion of the substrate; pasting a fixing piece on a surface of the LED wafer; fixing the LED wafer to an extensible membrane, wherein the light-emitting unit faces the extensible membrane, and the LED wafer is disposed between the fixing piece and the extensible membrane, and the fixing piece, the LED wafer and the extensible membrane form a complex; breaking the LED wafer in the complex to form a plurality of LED dices; removing the fixing piece from the complex to remain the LED dices disposed on the extensible membrane; and expanding the extensible membrane to make a distance between any two of the LED dices become larger.
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Specification