SemiFlexible Printed Circuit Board With Embedded Component
First Claim
1. A circuit board, comprising:
- a dielectric layer which comprisesa planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, anda layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis;
a metallic layer which is attached to the dielectric layer in a planar manner; and
a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board;
wherein the dielectric layer comprises a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.
1 Assignment
0 Petitions
Accused Products
Abstract
A circuit board and a method of manufacturing a circuit board or two circuit boards are illustrated and described. The circuit board includes (a) a dielectric layer with a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; (b) a metallic layer which is attached to the dielectric layer in a planar manner; and (c) a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board. The dielectric layer includes a dielectric material which has (i) an elastic modulus E in a range between 1 and 20 GPa and (ii) a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.
12 Citations
25 Claims
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1. A circuit board, comprising:
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a dielectric layer which comprises a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; a metallic layer which is attached to the dielectric layer in a planar manner; and a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board;
wherein the dielectric layer comprises a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis. - View Dependent Claims (2, 3, 4, 6, 7, 8, 9, 10, 11, 12, 13, 15, 23, 24)
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5. (canceled)
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14. (canceled)
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16. A method of manufacturing a circuit board, the method, comprising:
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providing a dielectric layer which comprises a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and comprises a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; and embedding a component in the dielectric layer and/or in a dielectric core-layer of the circuit board, wherein the dielectric core-layer is attached to the dielectric layer;
whereinthe dielectric layer comprises a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and has a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis. - View Dependent Claims (17, 18, 20, 21)
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19. (canceled)
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22. (canceled)
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25. (canceled)
Specification