3DIC Packaging with Hot Spot Thermal Management Features

• US 20170345732A1
• Filed: 08/14/2017
• Published: 11/30/2017
• Est. Priority Date: 12/04/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Hung, Wensen, Huang, Szu-Po, Lee, Hsiang-Fan, Chen, Kim Hong, Wu, Chi-Hsi, Jeng, Shin-Puu
• Granted Patent: US 10,157,813 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/13025 the bump connector being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/29011 comprising apertures or cavities
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29294 with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 2224/33519 including layer connectors providing primarily thermal dissipation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 2224/92225 the second connecting process involving a layer connector
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06568 : the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 2225/06589 : Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/04 : characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/10 : characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/36 : Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3675 : characterised by the shape of the housing
• CPC Class Codes: H01L 23/3677 : Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/42 : Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49822 : Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1431 : Logic devices
• CPC Class Codes: H01L 2924/1432 : Central processing unit [CPU]
• CPC Class Codes: H01L 2924/1434 : Memory
• CPC Class Codes: H01L 2924/1436 : Dynamic random-access memory [DRAM]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16153 : Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
• CPC Class Codes: H01L 2924/16251 : Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/1679 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate

Abstract

A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

Claims

1. A package comprising:

a substrate comprising a conductive layer;

a first die stack over the substrate and electrically connected to the conductive layer;

a second die stack over the substrate and adjacent the first die stack, wherein the first die stack extends higher than the second die stack;

a thermally conductive material over the substrate and contacting an electrically conductive material of conductive layer; and

a heat dissipation feature thermally connected to the electrically conductive material through the thermally conductive material, wherein a first bottom surface of the heat dissipation feature over the first die stack is higher than a second bottom surface of the heat dissipation feature over the second die stack, and wherein a portion of the heat dissipation feature extends between the first die stack and the second die stack along a line parallel to a top surface of the substrate.

2. The package of claim 1, wherein the portion of the heat dissipation feature is directly connected to the substrate by an additional thermally conductive material.

3. The package of claim 1, wherein the thermally conductive material comprises a thermal interface material, silver paste, solder, or a combination thereof.

4. The package of claim 1, wherein the electrically conductive material of the conductive layer is part of a signal line, a power line, or a ground line.

5. The package of claim 1, wherein the electrically conductive material of the conductive layer is a dummy feature.

6. The package of claim 1, wherein the heat dissipation feature is attached to the substrate by an adhesive having a lower thermal conductivity than the thermally conductive material.

7. The package of claim 1 further comprising:

a first thermal interface material between the first die stack and the heat dissipation feature, wherein the first thermal interface material is disposed over and along sidewalls of the first die stack; and

a second thermal interface material between the second die stack and the heat dissipation feature, wherein the second thermal interface material is disposed over and along sidewalls of the second die stack.

8. The package of claim 7, further comprising a passive device on the substrate and disposed between the first thermal interface material and the thermally conductive material along the line parallel to the top surface of the substrate.

9. A method comprising:

forming a conductive layer at a front side of a package substrate;

forming a solder resist over the front side of the package substrate;

patterning a first opening exposing a first portion of the conductive layer through the solder resist;

patterning a second opening exposing a second portion of the conductive layer through the solder resist, the second portion of the conductive layer being electrically connected to the first portion of the conductive layer;

attaching a die stack to the package substrate, wherein the die stack is electrically connected to the conductive layer, and wherein the die stack comprises one or more top dies bonded to a bottom die;

disposing a first thermally conductive material in the first opening and physically contacting the first portion of the conductive layer;

disposing a second thermally conductive material in the second opening and physically contacting the second portion of the conductive layer, wherein a line perpendicular to a top surface of the package substrate extends through the package substrate, the second thermally conductive material, and the one or more top dies; and

attaching a heat dissipation feature to the package substrate, wherein the heat dissipation feature is thermally connected to the second thermally conductive material through the first thermally conductive material.

10. The method of claim 9, wherein the first portion of the conductive layer is electrically connected to the second portion of the conductive layer by a signal line, a power line, or a ground line.

11. The method of claim 9, wherein the second thermally conductive material physically contacts the one or more top dies.

12. The method of claim 9, wherein the heat dissipation feature comprises:

a conductive ring encircling the die stack, wherein the conductive ring is thermally connected to the second thermally conductive material through the first thermally conductive material; and

a conductive lid directly attached to the one or more top dies by a thermal interface material.

13. The method of claim 12, wherein the conductive ring is thermally connected to one or more top dies by the conductive lid.

14. The method of claim 9, wherein attaching the heat dissipation feature to the package substrate comprises using an adhesive.

15. The method of claim 9 further comprising disposing a passive device between the first thermally conductive material and the second thermally conductive material.

16. The method of claim 9, wherein the first thermally conductive material and the second thermally conductive material each comprise a thermal interface material, solder, silver paste, or a combination thereof.

17. A package comprising:

a die stack bonded to a front side of a package substrate, wherein the die stack is electrically connected to a conductive layer at a front side of the package substrate;

a first material over and physically contacting an electrically conductive material of the conductive layer, wherein the first material has a thermal conductivity between 3 W/m·

K and 50 W/m·

K; and

a heat dissipation feature attached to the front side of the package substrate using an adhesive having a lower thermal conductivity than the first material, wherein the heat dissipation feature is in physical contact with the first material, and wherein the adhesive is disposed on opposing sidewalls of the first material.

18. The package of claim 17, further comprising a solder resist, wherein the first material extends through the solder resist, wherein a first portion of the solder resist encircles the die stack in a top down view, wherein the first material encircles the first portion of the solder resist in the top down view, and wherein a second portion of solder resist encircles the first material in the top down view.

19. The package of claim 17 further comprising a second material contacting the die stack, wherein the second material has a thermal conductivity between 3 W/m·

K and 50 W/m·

K, and wherein the first material is thermally connected to the die stack by the second material.

20. The package of claim 17 further comprising a second die stack bonded to the front side of the package substrate, wherein the adhesive is physically separates the die stack from the second die stack in a top down view.