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PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

  • US 20170345761A1
  • Filed: 09/01/2016
  • Published: 11/30/2017
  • Est. Priority Date: 05/31/2016
  • Status: Active Grant
First Claim
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1. A package structure, comprisinga first die, a second die and a third die, molded in a molding compound;

  • a first redistribution layer, disposed on the molding compound and electrically connected to the first die, the second die and the third die;

    an antenna, located on the molding compound and electrically connected to the first die, the second die and the third die, wherein a distance of an electrical connection path between the first die and the antenna is smaller than or equal to a distance of an electrical connection path between the second die and the antenna and a distance of an electrical connection path between the third die and the antenna; and

    conductive elements, connected to the first redistribution layer, wherein the first redistribution layer is located between the conductive elements and the molding compound.

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