PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
First Claim
1. A package structure, comprisinga first die, a second die and a third die, molded in a molding compound;
- a first redistribution layer, disposed on the molding compound and electrically connected to the first die, the second die and the third die;
an antenna, located on the molding compound and electrically connected to the first die, the second die and the third die, wherein a distance of an electrical connection path between the first die and the antenna is smaller than or equal to a distance of an electrical connection path between the second die and the antenna and a distance of an electrical connection path between the third die and the antenna; and
conductive elements, connected to the first redistribution layer, wherein the first redistribution layer is located between the conductive elements and the molding compound.
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Accused Products
Abstract
A package structure has a first die, a second die, the third die, a molding compound, a first redistribution layer, an antenna and conductive elements. The first die, the second die and the third die are molded in a molding compound. The first redistribution layer is disposed on the molding compound and is electrically connected to the first die, the second die and the third die. The antenna is located on the molding compound and electrically connected to the first die, the second die and the third die, wherein a distance of an electrical connection path between the first die and the antenna is smaller than or equal to a distance of an electrical connection path between the second die and the antenna and a distance of an electrical connection path between the third die and the antenna. The conductive elements are connected to the first redistribution layer, wherein the first redistribution layer is located between the conductive elements and the molding compound.
56 Citations
20 Claims
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1. A package structure, comprising
a first die, a second die and a third die, molded in a molding compound; -
a first redistribution layer, disposed on the molding compound and electrically connected to the first die, the second die and the third die; an antenna, located on the molding compound and electrically connected to the first die, the second die and the third die, wherein a distance of an electrical connection path between the first die and the antenna is smaller than or equal to a distance of an electrical connection path between the second die and the antenna and a distance of an electrical connection path between the third die and the antenna; and conductive elements, connected to the first redistribution layer, wherein the first redistribution layer is located between the conductive elements and the molding compound. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A manufacturing method of a package structure, comprising:
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disposing a first die, a second die and a third die on a carrier, encapsulating the first die, the second die and the third die in a molding compound; forming a first redistribution layer on the molding compound, wherein the first redistribution layer is electrically connected to the first die, the second die and the third die; forming an antenna on the carrier, wherein the antenna is electrically connected to the first die, the second die and the third die, and a distance of an electrical connection path between the first die and the antenna is smaller than or equal to a distance of an electrical connection path between the second die and the antenna and a distance of an electrical connection path between the third die and the antenna; disposing conductive elements on the first redistribution layer, wherein the first redistribution layer is located between the molding compound and the conductive elements; and debonding the carrier from the antenna. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A manufacturing method of a package structure, comprising:
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forming a sub-package, comprising; disposing a first die, a second die and a third die on a first carrier; encapsulating the first die, the second die and the third die in a molding compound; forming a first redistribution layer on the molding compound, wherein the first redistribution layer is electrically connected to the first die, the second die and the third die, and the molding compound is located between the first redistribution layer and the first carrier, forming a second redistribution layer on the first carrier, wherein the second redistribution layer is between the molding compound and the first carrier, forming at least one second through interlayer via on the second redistribution layer and encapsulated in the molding compound, wherein the at least one second through interlayer via is electrically connected to the first redistribution layer and the second redistribution layer, disposing conductive elements on the first redistribution layer, wherein the first redistribution layer is located between the molding compound and the conductive elements; and debonding the first carrier, providing an antenna package; and disposed the antenna package onto the second redistribution layer of the sub-package, wherein the antenna package is electrically connected the second redistribution layer through flip chip bonding technology and/or surface mount technology, and is electrically connected to the first die, the second die and the third die, and a distance of an electrical connection path between the first die and the antenna package is smaller than or equal to a distance of an electrical connection path between the second die and the antenna package and a distance of an electrical connection path between the third die and the antenna package. - View Dependent Claims (20)
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Specification