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PACKAGE STRUCTURES, POP DEVICES AND METHODS OF FORMING THE SAME

  • US 20170345795A1
  • Filed: 08/17/2016
  • Published: 11/30/2017
  • Est. Priority Date: 05/30/2016
  • Status: Active Grant
First Claim
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1. A package structure, comprising:

  • a first chip;

    a redistribution layer structure electrically connected to the first chip, wherein the first chip is located on a first side of the redistribution layer structure;

    a plurality of under-ball metallurgy (UBM) pads electrically connected to the redistribution layer structure;

    a plurality of connectors electrically connected to the plurality of UBM pads; and

    a separator over the redistribution layer structure and surrounding the connectors, wherein the plurality of connectors and the separator are located on at a second side of the redistribution layer structure, and the first side is opposite to the second side.

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