PACKAGE STRUCTURES, POP DEVICES AND METHODS OF FORMING THE SAME
First Claim
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1. A package structure, comprising:
- a first chip;
a redistribution layer structure electrically connected to the first chip, wherein the first chip is located on a first side of the redistribution layer structure;
a plurality of under-ball metallurgy (UBM) pads electrically connected to the redistribution layer structure;
a plurality of connectors electrically connected to the plurality of UBM pads; and
a separator over the redistribution layer structure and surrounding the connectors, wherein the plurality of connectors and the separator are located on at a second side of the redistribution layer structure, and the first side is opposite to the second side.
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Abstract
Package structures, PoP devices and methods of forming the same are disclosed. A package structure includes a first chip, a redistribution layer structure, a plurality of UBM pads, a plurality of connectors and a separator. The redistribution layer structure is electrically connected to the first chip. The UBM pads are electrically connected to the redistribution layer structure. The connectors are electrically connected to the UBM pads. The separator is over the redistribution layer structure and surrounds the connectors.
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Citations
20 Claims
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1. A package structure, comprising:
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a first chip; a redistribution layer structure electrically connected to the first chip, wherein the first chip is located on a first side of the redistribution layer structure; a plurality of under-ball metallurgy (UBM) pads electrically connected to the redistribution layer structure; a plurality of connectors electrically connected to the plurality of UBM pads; and a separator over the redistribution layer structure and surrounding the connectors, wherein the plurality of connectors and the separator are located on at a second side of the redistribution layer structure, and the first side is opposite to the second side. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A PoP device, comprising:
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a first package structure, having a first side and a second side opposite to the first side, and comprising; a first chip; a redistribution layer structure electrically connected to the first chip; a plurality of connectors electrically connected to the redistribution layer structure and exposed from the first side; and a separator on the first side of the first package structure and aside the connectors; a second package structure, over the second side of the first package structure; and an electromagnetic interface layer covering a top and a sidewall of the second package structure and electrically connected to the redistribution layer structure of the first package structure. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method of manufacturing a package structure, comprising:
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forming a redistribution layer structure over a first chip, wherein the redistribution layer structure is electrically connected to the first chip, and the first chip is located on a first side of the redistribution layer structure; forming a plurality of UBM pads and a first separator surrounding the UBM pads, wherein the plurality of UBM pads is electrically connected to the redistribution layer structure; and forming a plurality of connectors over the plurality of UBM pads, wherein the plurality of connectors and the first separator are located on at a second side of the redistribution layer structure, and the first side is opposite to the second side. - View Dependent Claims (18, 19, 20)
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Specification