SUBSTRATE BASED LIGHT EMITTER DEVICES, COMPONENTS, AND RELATED METHODS

• US 20170345866A1
• Filed: 08/14/2017
• Published: 11/30/2017
• Est. Priority Date: 03/30/2012
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Joo, Sung Chul, Andrews, Peter Scott, Welch, Erin R. F.
• Granted Patent: US 11,004,890 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12035 Zener diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.

Claims

1. A light emitting diode (LED) apparatus, comprising:

a substrate having an upper surface;

one or more LED disposed over the substrate; and

a light-transmissive encapsulant disposed over the one or more LED, wherein a top surface of the encapsulant comprises at least one or more scribe mark.

2. The LED apparatus of claim 1, wherein the scribe mark comprises substantially beveled or tapered side walls.

3. The LED apparatus of claim 1, wherein the scribe mark is in a form of a V-shaped trench.

4. The LED apparatus of claim 1, wherein the scribe mark comprises substantially straight side walls.

5. The LED apparatus of claim 1, wherein the scribe mark comprises substantially parallel side walls.

6. The LED apparatus of claim 1, comprising a plurality of LEDs.

7. The LED apparatus of claim 6, wherein the plurality of LEDs are arranged in a linear array.

8. The LED apparatus of claim 1, wherein the scribe mark has a depth that extends to a level above a top surface of the LED.

9. A method producing a light emitting diode (LED) apparatus, the method comprising:

providing a substrate;

providing at least one LED disposed over the substrate;

applying an encapsulant over the at least one LED; and

removing material from a top surface of the encapsulant to create at least one or more scribe mark in the encapsulant.

10. The method of claim 9, wherein removing material from the top surface of the encapsulant comprises creating the scribe mark with substantially beveled or tapered side walls.

11. The method of claim 9, wherein removing material from the top surface of the encapsulant comprises creating the scribe mark in a form of a V-shaped trench. The method of claim 9, wherein removing material from the top surface of the encapsulant comprises creating the scribe mark with substantially straight side walls.

13. The method of claim 9, wherein removing material from the top surface of the encapsulant comprises creating the scribe mark with substantially parallel side walls.

14. The method of claim 9, wherein removing material from the top surface of the encapsulant comprises creating the scribe mark with a depth that extends to a level above a top surface of the LED.