PROCESS FOR PRODUCING AN OPTOELECTRONIC COMPONENT, OPTOELECTRONIC COMPONENT AND PROTECTIVE LAYER

• US 20170346040A1
• Filed: 05/24/2017
• Published: 11/30/2017
• Est. Priority Date: 05/24/2016
• Status: Active Grant

• Current Assignee: Pictiva Displays International Limited (f/k/a Dolya Holdco 5 Limited) (Key Patent Innovations Limited)
• Original Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Inventors: Fleissner, Arne
• Granted Patent: US 11,322,717 B2
• Time in Patent Office: Days
• CPC Class Codes: H10K 50/805 Electrodes
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/88 Terminals, e.g. bond pads
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/611 using printing deposition, e.g. ink jet printing

Abstract

Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.

Claims

1. A process for producing an optoelectronic component, comprising:

forming a first electrode and at least one contact section atop a carrier;

forming an optically functional layer structure atop the first electrode;

forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section;

applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer; and

forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.

2. The process of claim 1,

wherein the substance for production of the encapsulation layer is a precursor.

3. The process of claim 1,

wherein the material of the protective layer is repellent to at least two precursors.

4. The process of claim 2,

wherein the encapsulation layer is formed by an atomic layer deposition process or of a molecular layer deposition process.

5. The process of claim 1,

wherein the protective layer is applied in structured form in the subregion.

6. The process of claim 5,

wherein the materials of the protective layer and of the contact section are such that the material of the protective layer accumulates exclusively in the contact section.

7. The process of claim 1,

wherein the protective layer takes the form of a self-assembled monolayer.

8. An optoelectronic component, comprising:

a first electrode and at least one contact section atop a carrier;

an optically functional layer structure atop the first electrode;

a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section;

a protective layer on at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer; and

the encapsulation layer atop the second electrode;

wherein the subregion is free of the encapsulation layer.

9. The optoelectronic component of claim 8,

wherein the substance for production of the encapsulation layer is a precursor which is required for production of the encapsulation layer.

10. The optoelectronic component of claim 9,

wherein the material of the protective layer is repellent to at least two precursors that are required for production of the encapsulation layer.

11. The optoelectronic component of claim 8,

wherein the encapsulation layer is formed by an ALD process or an MLD process.

12. The optoelectronic component of claim 8,

wherein the protective layer is formed exclusively in the subregion.

13. The optoelectronic component of claim 12,

wherein the materials of the protective layer and of the contact section are such that the material of the protective layer accumulates exclusively in the contact section.

14. The optoelectronic component of claim 8,

wherein the protective layer is a self-assembled monolayer.

15. A protective layer on a contact section for forming electrical contacts with an electronic or optoelectronic component, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer for encapsulation of the electronic or optoelectronic component.