HIGH-FREQUENCY ANTENNA STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND HIGH SURFACE AREA

• US 20170347490A1
• Filed: 05/24/2016
• Published: 11/30/2017
• Est. Priority Date: 05/24/2016
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments Deutschland Gesellschaft Mit Beschrã¤Nkter Haftung (Texas Instruments, Inc.), Texas Instruments, Inc.
• Inventors: Romig, Matthew David, Keller, Robert Clair, Li, Ming, Tang, Yiqi
• Application Number:
  US15/162,888
• Publication Number:
  US 20170347490A1
• Time in Patent Office: Days
• CPC Class Codes: H01Q 1/02 Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 21/061 Two dimensional planar arrays
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the PCB heatsink inserted in the PCB H05K2201/10416
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

A heat dissipating antenna comprised of a low-attenuating heat spreader bonded to a high frequency antenna or antenna array.

An integrated circuit with a wireless integrated circuit chip, and a heat dissipating antenna coupled to the wireless integrated circuit chip. A method of forming a heat dissipating antenna.

Claims

1-20. -20. (canceled)

21. An apparatus comprising:

a substrate;

at least one integrated circuit attached to the substrate;

an antenna attached to the at least one integrated circuit; and

a first heat spreader attached to the antenna.

22. The apparatus of claim 21 further comprising a second heat spreader attached to the substrate.

23. The apparatus of claim 21 further comprising at least one electrical component attached to the substrate.

24. The apparatus of claim 21, wherein the first heat spreader is attached to the antenna using a heat conductive epoxy.

25. The apparatus of claim 21, wherein the first heat spreader is a parallel plate heat spreader.

26. The apparatus of claim 21, wherein the first heat spreader is a flat plate heat spreader.

27. The apparatus of claim 21, wherein the first heat spreader is a parallel pillar heat spreader.

28. The apparatus of claim 21, wherein the first heat spreader is composed of dielectric material.

29. The apparatus of claim 28, wherein the dielectric material is one of aluminum nitride, beryllium oxide, aluminum oxide, silicon carbide, and boron nitride.

30. The apparatus of claim 21, wherein the at least one integrated circuit is one of a radio frequency chip and a baseband chip.

31. The apparatus of claim 22, wherein the second heat spreader is one of a parallel plate heat spreader, a flat plate heat spreader, and a parallel pillar heat spreader.

32. The apparatus of claim 22, wherein the second heat spreader is composed of dielectric material.

33. An apparatus comprising:

a substrate;

at least one integrated circuit attached to the substrate; and

an antenna structure attached to the at least one integrated circuit, the antenna structure comprising;

an antenna; and

a first heat spreader electrically connected to the antenna.

34. The apparatus of claim 33 further comprising a second heat spreader attached to the substrate.

35. The apparatus of claim 33 further comprising at least one electrical component attached to the substrate.

36. The apparatus of claim 33, wherein the first heat spreader is composed of dielectric material.

37. The apparatus of claim 36, wherein the dielectric material is one of aluminum nitride, beryllium oxide, aluminum oxide, silicon carbide, and boron nitride.

38. The apparatus of claim 33, wherein the antenna structure comprises an array of antennas.

39. An apparatus comprising:

a substrate;

at least one integrated circuit attached to the substrate;

an antenna attached to the at least one integrated circuit; and

a first heat spreader directly attached to the antenna using a conductive epoxy.

40. The apparatus of claim 39 further comprising a second heat spreader attached to the substrate.