CAPACITOR MODULE

• US 20170352495A1
• Filed: 12/21/2015
• Published: 12/07/2017
• Est. Priority Date: 01/08/2015
• Status: Abandoned Application

• Current Assignee: Autonetworks Technologies, Ltd. (Sumitomo Corporation), Sumitomo Electric Industries Limited (Sumitomo Corporation), Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Original Assignee: Autonetworks Technologies, Ltd. (Sumitomo Corporation), Sumitomo Electric Industries Limited (Sumitomo Corporation), Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Inventors: Sato, Shinichiro
• Application Number:
  US15/541,779
• Publication Number:
  US 20170352495A1
• Time in Patent Office: Days
• CPC Class Codes: H01G 11/08 Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
• CPC Class Codes: H01G 11/10 Multiple hybrid or EDL capacitors, e.g. arrays or modules housings, cases, encapsulations or mountings thereof H01G11/78
• CPC Class Codes: H01G 11/74 Terminals, e.g. extensions of current collectors
• CPC Class Codes: H01G 11/76 specially adapted for integration in multiple or stacked hybrid or EDL capacitors
• CPC Class Codes: H01G 11/78 Cases; Housings; Encapsulations; Mountings
• CPC Class Codes: H01G 11/82 Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
• CPC Class Codes: H01G 2/04 specially adapted for mounting on a chassis
• CPC Class Codes: H01G 9/08 Housing; Encapsulation
• CPC Class Codes: H01G 9/28 Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/10424 Frame holders
• CPC Class Codes: H05K 2201/10757 Bent leads
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/306 Lead-in-hole components, e.g. affixing or retention before soldering, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 5/0026 provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
• CPC Class Codes: H05K 5/0056 characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors

Abstract

A capacitor module has a module case including a lower case and an upper case. A housing case is fixed to an inner face of the upper case, and a capacitor is housed in the housing case. A circuit board is fixed to an upper face of the lower case. The circuit board has wiring that is electrically connectable to the capacitor, and electronic components and constituting a circuit that controls electric current to the capacitor are mounted on the circuit board.

Claims

1. A capacitor module, comprising:

a module case including a lower case and an upper case;

a housing case fixed to an inner face of the upper case;

at least one capacitor housed in the housing case;

a circuit board fixed to an upper face of the lower case, the circuit board having wiring electrically connectable to the at least one capacitor, and electronic components constituting a circuit that controls electric current to the at least one capacitor being mounted to the circuit board; and

an external connection connector fixed to the lower case and including a terminal connected to wiring of the circuit board.

2. The capacitor module according to claim 1,

wherein the upper case includes:

an upper plate that fixedly supports the housing case,

a side plate extending from an end portion of the upper plate in a direction orthogonal to the upper plate, and

a terminal holding plate fixed to the side plate and holding a terminal of the at least one capacitor.

3. The capacitor module according to claim 2,

wherein the at least one capacitor has a capacitor body that can be housed in the housing case, and a lead wire that protrudes from the capacitor body, and

the circuit board has a connection hole where the lead wire of the at least one capacitor can be electrically connected.

4. The capacitor module according to claim 3,

wherein the lead wire of the at least one capacitor has a press-fit terminal having a press-in portion that is wider than an inner diameter of the connection hole at its tip and is elastically deformable, and

the press-in portion of the press-fit terminal is pressed into the connection hole of the circuit board.

5. The capacitor module according to claim 4,

wherein the press-fit terminal has an attachment portion that protrudes in a direction orthogonal to the lead wire, and

the terminal holding plate is arranged closer to the capacitor body side than the attachment portion, and holds the press-fit terminal.

6. The capacitor module according to claim 1,

wherein the electronic component includes an electronic component mounted on a lower case side mounting face of the circuit board, and an electronic component mounted on a capacitor side mounting face opposite to the lower case side mounting face of the circuit board,

the heating quantity of the electronic component mounted on the lower case side mounting face being larger than the heating quantity of the electronic component mounted on the capacitor side mounting face.

7. The capacitor module according to claim 1,

wherein the housing case and the circuit board face each other with an open space therebetween, and at least one of the electronic components faces the housing case in the open space.

8. The capacitor module according to claim 2, wherein the electronic component includes an electronic component mounted on a lower case side mounting face of the circuit board, and an electronic component mounted on a capacitor side mounting face opposite to the lower case side mounting face of the circuit board, the heating quantity of the electronic component mounted on the lower case side mounting face being larger than the heating quantity of the electronic component mounted on the capacitor side mounting face.

9. The capacitor module according to claim 3, wherein the electronic component includes an electronic component mounted on a lower case side mounting face of the circuit board, and an electronic component mounted on a capacitor side mounting face opposite to the lower case side mounting face of the circuit board, the heating quantity of the electronic component mounted on the lower case side mounting face being larger than the heating quantity of the electronic component mounted on the capacitor side mounting face.

10. The capacitor module according to claim 4, wherein the electronic component includes an electronic component mounted on a lower case side mounting face of the circuit board, and an electronic component mounted on a capacitor side mounting face opposite to the lower case side mounting face of the circuit board, the heating quantity of the electronic component mounted on the lower case side mounting face being larger than the heating quantity of the electronic component mounted on the capacitor side mounting face.

11. The capacitor module according to claim 5, wherein the electronic component includes an electronic component mounted on a lower case side mounting face of the circuit board, and an electronic component mounted on a capacitor side mounting face opposite to the lower case side mounting face of the circuit board, the heating quantity of the electronic component mounted on the lower case side mounting face being larger than the heating quantity of the electronic component mounted on the capacitor side mounting face.

12. The capacitor module according to claim 2, wherein the housing case and the circuit board face each other with an open space therebetween, and at least one of the electronic components faces the housing case in the open space.

13. The capacitor module according to claim 3, wherein the housing case and the circuit board face each other with an open space therebetween, and at least one of the electronic components faces the housing case in the open space.

14. The capacitor module according to claim 4, wherein the housing case and the circuit board face each other with an open space therebetween, and at least one of the electronic components faces the housing case in the open space.

15. The capacitor module according to claim 5, wherein the housing case and the circuit board face each other with an open space therebetween, and at least one of the electronic components faces the housing case in the open space.

16. The capacitor module according to claim 6, wherein the housing case and the circuit board face each other with an open space therebetween, and at least one of the electronic components faces the housing case in the open space.