DEPOSITION OF ORGANIC FILMS
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Abstract
Processes are provided herein for deposition of organic films. Organic films can be deposited, including selective deposition on one surface of a substrate relative to a second surface of the substrate. For example, polymer films may be selectively deposited on a first metallic surface relative to a second dielectric surface. Selectivity, as measured by relative thicknesses on the different layers, of above about 50% or even about 90% is achieved. The selectively deposited organic film may be subjected to an etch process to render the process completely selective. Processes are also provided for particular organic film materials, independent of selectivity.
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Citations
53 Claims
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47. A process for selectively depositing an organic film on a substrate comprising a first surface and a second surface, the process comprising:
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one or more deposition cycles comprising; contacting the substrate with a first vapor phase precursor; and contacting the substrate with a second vapor phase precursor; wherein contacting the substrate with the first and second vapor phase precursors forms the organic thin film selectively on the first surface relative to the second surface, and subjecting the substrate to an etch process, wherein the etch process removes substantially all of any deposited organic film from the second surface of the substrate and does not remove substantially all of the deposited organic film from the first surface of the substrate. - View Dependent Claims (4, 5, 6, 7, 8, 10, 12, 13, 14, 18, 20, 22, 23, 24, 25, 28, 29, 48, 49)
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50. A process for selectively depositing an organic film on a substrate comprising a first surface and a second surface, the process comprising one or more deposition cycles comprising:
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contacting the first surface and the second surface of the substrate with a first vapor phase precursor; and contacting the first surface and the second surface of the substrate with a second vapor phase precursor; wherein contacting the first surface and the second surface of the substrate with the first and second vapor phase precursors forms the organic thin film selectively on the first surface relative to the second surface, wherein the second surface comprises an inorganic dielectric surface, and wherein the first surface comprises tungsten.
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51. A process for selectively depositing an organic film on a substrate comprising a first surface and a second surface, the process comprising:
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one or more deposition cycles comprising; contacting the first surface and the second surface of the substrate with a first vapor phase precursor; and contacting the first surface and the second surface of the substrate with a second vapor phase precursor; wherein contacting the first surface and the second surface of the substrate with the first and second vapor phase precursors forms the organic thin film selectively on the first surface relative to the second surface, wherein the second surface comprises an inorganic dielectric surface, repeating the contacting steps until an organic thin film of a desired thickness has been formed; and subjecting the substrate to an etch process, wherein the etch process removes substantially all of any deposited organic film from the second surface of the substrate and does not remove substantially all of the deposited organic film from the first surface of the substrate. - View Dependent Claims (52, 53)
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Specification