ELECTRONIC DEVICE FOR VEHICLE

• US 20170352608A1
• Filed: 12/21/2015
• Published: 12/07/2017
• Est. Priority Date: 01/08/2015
• Status: Active Application

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: SUEYOSHI, Tetsuya, ANDO, Hiroaki
• Granted Patent: US 10,256,170 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20145 Means for directing air flow, e.g. ducts, deflectors, plenum or guides
• CPC Class Codes: H05K 7/20863 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20972 Forced ventilation, e.g. on heat dissipaters coupled to components

Abstract

An electronic device for a vehicle includes a substrate and a semiconductor package. The substrate is arranged to extend along a flowing path of wind produced by a fan unit. The semiconductor package is disposed on the substrate to be cooled by the wind. When an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area.

Claims

1. An electronic device for a vehicle comprising:

a flexible substrate arranged to extend along a flowing path of wind produced by a fan unit; and

a semiconductor package disposed on the flexible substrate to be cooled by the wind, wherein

when an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area, and

the flexible substrate electrically connects a touch panel operated by a user to a printed-circuit board on which an electronic component is mounted.

2. The electronic device according to claim 1, wherein

the cross-section area that is larger than the first cross-section area is larger than a cross-section area of a second space to which the wind flows in directly from the inflow port.

3. The electronic device according to claim 1, wherein

the semiconductor package is arranged in the space where a condition that a main path of the wind is separated from the flexible substrate is satisfied due to the wind being reflected by the flexible substrate.

4. The electronic device according to claim 1, further comprising:

a reinforcing board to reinforce the flexible substrate corresponding to a region where the semiconductor package is arranged.