INFORMATION PROCESSING APPARATUS

• US 20170354027A1
• Filed: 12/09/2015
• Published: 12/07/2017
• Est. Priority Date: 12/12/2014
• Status: Active Grant

• Current Assignee: Autonetworks Technologies, Ltd. (Sumitomo Corporation), Sumitomo Electric Industries Limited (Sumitomo Corporation), Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Original Assignee: Autonetworks Technologies, Ltd. (Sumitomo Corporation), Sumitomo Electric Industries Limited (Sumitomo Corporation), Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Inventors: Inoue, Masayuki
• Granted Patent: US 10,194,520 B2
• Time in Patent Office: Days
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: C09J 9/00 Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks C09J7/00 takes precedence
• CPC Class Codes: C09K 5/14 Solid materials, e.g. powdery or granular
• CPC Class Codes: G06F 21/602 Providing cryptographic facilities or services
• CPC Class Codes: G06F 21/72 in cryptographic circuits
• CPC Class Codes: G06F 21/86 Secure or tamper-resistant housings
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the printed circuit board [PCB]
• CPC Class Codes: H05K 2201/10272 Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors

Abstract

Provided is an information processing apparatus that enables acquisition, manipulation and the like of information through unauthorized access to be prevented with a simple structure, without needing constant supply of power. A control apparatus (20) operates using power supply from a built-in power source (30), in the case where power is not supplied from an external power source (3). In the case where a photoelectric conversion unit (31) performs photoelectric conversion and the built-in power source (30) supplies power to the control apparatus (20), the voltage output by the photoelectric conversion unit (31) is input to an input unit (24), when a switch (50) is ON. On the other hand, when the switch (50) is OFF, a voltage value of zero volts is input to the input unit (24).

Claims

1. A circuit assembly comprising:

a circuit board;

a heat dissipation member on which the circuit board is placed and that is configured to release heat of the circuit board;

an insulating layer that is formed on a surface on the circuit board side of the heat dissipation member;

a bonding portion made of a bonding agent that is arranged in a predetermined region between the circuit board and the heat dissipation member; and

an adhesive portion that is arranged in a region other than the predetermined region between the circuit board and the heat dissipation member and that is made of an adhesive with which the circuit board and the heat dissipation member are bonded to each other with lower bonding force than with the bonding agent.

2. The circuit assembly according to claim 1, wherein the insulating layer is made of an adhesive that is the same as the adhesive.

3. The circuit assembly according to claim 1, wherein the adhesive is an epoxy resin-based adhesive.

4. The circuit assembly according to claim 1, wherein the adhesive is a heat dissipation adhesive having high heat conductivity.

5. The circuit assembly according to claim 4, wherein an electronic component is mounted on the circuit board, and the heat dissipation adhesive is provided in a region over which the electronic component is located.

6. The circuit assembly according to claim 1, wherein the circuit board includes an insulating board obtained by forming a conductive path on an insulating plate, and a busbar made of a metal on which the insulating board is placed, and the adhesive is in intimate contact with the busbar.

8. The circuit assembly according to claim 2, wherein the adhesive is an epoxy resin- based adhesive.

9. The circuit assembly according to claim 2, wherein the adhesive is a heat dissipation adhesive having high heat conductivity.

10. The circuit assembly according to claim 3, wherein the adhesive is a heat dissipation adhesive having high heat conductivity.

11. The circuit assembly according to claim 2, wherein the circuit board includes an insulating board obtained by forming a conductive path on an insulating plate, and a busbar made of a metal on which the insulating board is placed, and the adhesive is in intimate contact with the busbar.

12. The circuit assembly according to claim 3, wherein the circuit board includes an insulating board obtained by forming a conductive path on an insulating plate, and a busbar made of a metal on which the insulating board is placed, and the adhesive is in intimate contact with the busbar.

13. The circuit assembly according to claim 4, wherein the circuit board includes an insulating board obtained by forming a conductive path on an insulating plate, and a busbar made of a metal on which the insulating board is placed, and the adhesive is in intimate contact with the busbar.

14. The circuit assembly according to claim 5, wherein the circuit board includes an insulating board obtained by forming a conductive path on an insulating plate, and a busbar made of a metal on which the insulating board is placed, and the adhesive is in intimate contact with the busbar.

7. A method for manufacturing a circuit assembly, the method comprising:

forming an insulating layer on a surface of a heat dissipation member;

providing a bonding agent in a predetermined region on the insulating layer;

providing an adhesive with which a circuit board and the heat dissipation member are bonded to each other with lower bonding force than with the bonding agent in a region other than the predetermined region; and

bonding the circuit board and the heat dissipation member to each other.