Reticle Cooling by Non-Uniform Gas Flow

• US 20170363973A1
• Filed: 12/02/2015
• Published: 12/21/2017
• Est. Priority Date: 12/31/2014
• Status: Active Grant

• Current Assignee: ASML Holding NV
• Original Assignee: ASML Holding NV, ASML Netherlands BV (ASML Holding NV)
• Inventors: VENTURINO, Thomas, SCHULTZ, Geoffrey Alan, GALBURT, Daniel Nicholas, BURBANK, Daniel Nathan, DELPUERTO, Santiago E., VOGEL, Herman, ONVLEE, Johannes, VAN BOKHOVEN, Laurentius Johannes Adrianus, WARD, Christopher Charles
• Granted Patent: US 10,423,081 B2
• Time in Patent Office: Days
• CPC Class Codes: G03F 7/70875 Temperature, e.g. temperature control of masks or workpieces via control of stage temperature

Abstract

An apparatus, system, and method cool a patterning device by supplying a non-uniform gas flow. The apparatus and system include a gas supply structure that supplies a gas flow across the first surface of the patterning device. The gas supply structure includes a gas supply nozzle specially configured to create a non-uniform gas flow distribution. A greater volume or velocity of the gas flow is directed to desired portion of the patterning device.

Claims

1. A temperature control system, comprising:

a support configured to support an object, the object having a first surface and a second surface; and

a gas supply nozzle, the gas supply nozzle configured to supply a gas flow across the first surface and configured to produce a non-uniform gas flow profile exiting the gas supply nozzle by unevenly distributing a volume or a velocity of the gas flow.

2. The temperature control system of claim 1, wherein the gas supply nozzle provides a larger volume of gas flow toward either side of the object than toward a center of the object.

3. The temperature control system of claim 1, wherein the gas supply nozzle provides a greater velocity of gas flow toward either side of the object than toward a center of the object.

4. The temperature control system of claim 1, wherein the gas supply nozzle provides a greater volume and greater velocity of gas flow toward either side of the object than toward a center of the object.

5. The temperature control system of claim 1, wherein:

the gas supply nozzle comprises a flow distribution plate including gas outlet holes of constant size along a length of the gas supply nozzle; and

wherein an uneven distribution of the gas outlet holes produces the non-uniform gas flow profile.

6. The temperature control system of claim 1, wherein:

the gas supply nozzle comprises a flow distribution plate including gas outlet holes of various sizes along a length of the gas supply nozzle; and

wherein a distribution of the gas outlet holes according to size produces the non-uniform gas flow profile.

7. The lithographic apparatus of claim 6, wherein the distribution of the gas outlet holes according to size is non-uniform.

8. The temperature control system of claim 1, wherein:

the gas supply nozzle comprises a nozzle tip including a nozzle tip opening along a length of the nozzle tip; and

varying a height of the nozzle tip opening produces the non-uniform gas flow profile.

9. The temperature control system of claim 1, wherein:

the gas supply nozzle comprises a plurality of flow directing vanes along the length of the gas supply nozzle; and

the flow directing vanes create the non-uniform gas flow profile.

10. The temperature control system of claim 9, wherein:

an angle control encoder is coupled to each of the plurality of flow directing vanes and is configured to individually control the angle of each flow directing vane.

11. The temperature control system of claim 1, wherein:

the gas supply nozzle comprises a plurality of air amplifiers; and

the air amplifiers create the non-uniform gas flow profile.

12. The temperature control system of claim 1, wherein:

the gas supply nozzle comprises stacked nozzle tips; and

the gas supply nozzle tips have different gas flow exit angles and gas flow velocities to create the non-uniform gas flow profile.

13. A lithographic apparatus, comprising:

an illumination system configured to condition a radiation beam;

a patterning device support configured to support a patterning device, the patterning device having a first surface and a second surface, the patterning device being configured to impart the radiation beam with a pattern in its cross-section to form a patterned radiation beam;

a gas supply nozzle, the gas supply nozzle configured to supply a gas flow across the first surface and configured to produce a non-uniform gas flow profile exiting the gas supply nozzle by unevenly distributing a volume or a velocity of the gas flow;

a substrate table constructed to hold a substrate; and

a projection system configured to project the patterned radiation beam onto a target portion of the substrate.

14. The lithographic apparatus of claim 13, wherein the gas supply nozzle provides a larger volume of gas flow toward either side of the object than toward a center of the object.

15. The lithographic apparatus of claim 13, wherein the gas supply nozzle provides a greater velocity of gas flow toward either side of the object than toward a center of the object.

16. The lithographic apparatus of claim 13, wherein the gas supply nozzle provides a greater volume and greater velocity of gas flow toward either side of the object than toward a center of the object.

17. The lithographic apparatus of claim 13, wherein:

the gas supply nozzle comprises a flow distribution plate including gas outlet holes of constant size along a length of the gas supply nozzle; and

an uneven distribution of the gas outlet holes produces the non-uniform gas flow profile.

18. The lithographic apparatus of claim 13, wherein:

the gas supply nozzle comprises a flow distribution plate including gas outlet holes of various sizes along a length of the gas supply nozzle; and

a distribution of the gas outlet holes according to size produces the non-uniform gas flow profile.

19. The lithographic apparatus of claim 18, wherein the distribution of the gas outlet holes according to size is non-uniform.

20. The lithographic apparatus of claim 13, wherein:

the gas supply nozzle comprises a flow distribution plate including an opening along a length of the gas supply nozzle; and

varying a height of the opening produces the non-uniform gas flow profile.

21. The lithographic apparatus of claim 13, wherein:

the gas supply nozzle comprises a plurality of flow directing vanes along the length of the gas supply nozzle and wherein the flow directing vanes creates the non-uniform gas flow profile.

22. The lithographic apparatus of claim 21, wherein:

an angle control encoder is coupled to each of the plurality of flow directing vanes and configured to individually control the angle of each flow directing vane.

23. The lithographic apparatus of claim 13, wherein:

the gas supply nozzle comprises a plurality of air amplifiers; and

the air amplifiers create the non-uniform gas flow profile.

24. The lithographic apparatus of claim 13, wherein:

the gas supply nozzle comprises stacked nozzle tips; and

the stacked nozzle tips have different gas flow exit angles and gas flow velocities to create the non-uniform gas flow profile.