Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy Assembly

• US 20170365499A1
• Filed: 08/04/2015
• Published: 12/21/2017
• Est. Priority Date: 08/05/2014
• Status: Active Grant

• Current Assignee: Kulicke and Soffa Industries Incorporated
• Original Assignee: Uniqarta, Inc. (Kulicke and Soffa Industries Incorporated)
• Inventors: Marinov, Val
• Granted Patent: US 10,529,614 B2
• Time in Patent Office: Days
• CPC Class Codes: B32B 2037/268 Release layers
• CPC Class Codes: B32B 2038/0016 Abrading
• CPC Class Codes: B32B 2038/045 Slitting
• CPC Class Codes: B32B 2307/40 having particular optical properties
• CPC Class Codes: B32B 2310/0831 using UV radiation
• CPC Class Codes: B32B 2457/14 Semiconductor wafers
• CPC Class Codes: B32B 37/025 Transfer laminating
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 38/0004 Cutting, tearing or severing, e.g. bursting; Cutter details cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B32B 38/1858 using vacuum
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68318 Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/75251 : in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75314 : Auxiliary members on the pressing surface
• CPC Class Codes: H01L 2224/75317 : Removable auxiliary member
• CPC Class Codes: H01L 2224/83005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/83874 : Ultraviolet [UV] curing
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

Claims

1. A method comprising

a. releasing a discrete component from an interim handle and depositing the discrete component on a handle substrate, the discrete component having an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration, at least one side of the handle substrate having a length longer than at least one side of the discrete component.

2. The method of claim 1 further comprising attaching a release layer to the handle substrate such that the discrete component is releasably attached to the release layer.

3. The method of claim 2 in which the release layer comprises a thermally sensitive material, and in which the thermal sensitivity of the release layer causes a change in an adhesive strength of the release layer in response to an application of thermal energy.

4. The method of claim 2 in which the release layer comprises an ultraviolet (“

UV”

) light sensitive material, and in which the UV light sensitivity of the release layer causes a change in an adhesive strength of the release layer in response to an application of a UV light.

5. The method of claim 2 in which the release layer comprises multiple layers, in which a first layer of the multiple layers is a permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV sensitive.

16. The method of claim 2 further comprising depositing the discrete component onto a device substrate and releasing the discrete component from the handle substrate.

17. The method of claim 16 in which depositing the discrete component onto the device substrate comprises interconnecting the discrete component to the device substrate.

18. The method of claim 16 in which releasing the discrete component from the handle is at least partially contemporaneous with interconnecting the discrete component to the device substrate.

19. The method of claim 16 in which the releasing of the discrete component from the handle and the interconnecting of the discrete component to the device substrate are in response to a common trigger.

23. The method of claim 17 in which the interconnecting further comprises delivering thermal energy or UV-light to both interconnect the discrete component with the substrate and release the discrete component from the handle.

6-15. -15. (canceled)

20-22. -22. (canceled)

24-30. -30. (canceled)

31. An apparatus comprising

a discrete component having an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration, and

a handle substrate releasably attached to the discrete component, the handle and the discrete component having a configuration that is thicker than the discrete component.

32. The apparatus of claim 31 further comprising a release layer attached to the handle substrate such that the discrete component is releasably attached to the release layer.

33. The apparatus of claim 32 in which the release layer comprises a thermally sensitive material, and in which the thermal sensitivity of the release layer causes a change in an adhesive strength of the release layer in response to an application of thermal energy.

34. The apparatus of claim 32 in which the release layer comprises an ultraviolet light sensitive material, and in which the UV light sensitivity of the release layer causes a change in an adhesive strength of the release layer in response to an application of a UV light.

36. The apparatus of claim 32 in which the release layer comprises multiple layers, wherein a first layer of the multiple layers is attached to the handle and a second layer of the multiple layers is oriented for discrete component deposition.

38. The apparatus of claim 36 in which the second layer is one or more of UV sensitive and thermally sensitive.

40. The apparatus of claim 36 in which the first layer is sensitive comprises a permanent adhesive.

47. The apparatus of claim 31 in which the handle substrate includes at least one side at least 250 and 800 microns long.

155. The apparatus of claim 31 in which the handle and discrete component has a configuration that is broader than the discrete component.

156. The apparatus of claim 31 in which the handle and discrete component has a configuration that has the same width as the discrete component.

35. (canceled)

37. (canceled)

39. (canceled)

41-46. -46. (canceled)

48. (canceled)

49. A method comprising

a. applying a process step to cause a material between a surface of an ultra-thin, an ultra-small, or an ultra-thin and ultra-small discrete component and a substrate to which the ultra-thin and ultra-small discrete component is to be attached, to change to a state in which the material holds the ultra-thin and ultra-small discrete component on the substrate,

b. the processing step at least partially concurrently causing or resulting in a material that temporarily holds an opposite surface of the ultra-thin and ultra-small discrete component on a handle that is being held by a chuck of a pick and place tool, to change to a state in which the material no longer holds the ultra-thin and ultra-small discrete component to the handle.

50. The method of claim 49 in which causing the change in state comprises delivering thermal energy, UV light, or both.

51. The method of claim 49 in which the material that temporarily holds an opposite surface of the discrete component on a handle substrate comprises a release layer comprising multiple layers, in which a first layer of the multiple layers is a permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV sensitive.

53. The method of claim 51 in which the release layer comprises a thermally sensitive material, and in which the thermal sensitivity of the release layer causes a change in an adhesive strength of the release layer in response to an application of thermal energy.

54. The method of claim 51 in which the release layer comprises a UV light sensitive material, and in which the UV light sensitivity of the release layer causes a change in an adhesive strength of the release layer in response to an application of a UV light.

52. (canceled)

55-64. -64. (canceled)

65. A method comprising

a. depositing an ultra-thin wafer onto a handle substrate;

and

b. releasing a discrete component from the ultra-thin wafer, the discrete component having an ultra-thin configuration, handle substrate having a thickness of at least 50 microns.

66. The method of claim 65 further comprising attaching a release layer to the handle substrate such that the ultra-thin wafer is releasably attached to the release layer.

67. The method of claim 66 in which releasing the discrete component comprises dicing the ultra-thin wafer.

68. The method of claim 67 in which dicing the ultra-wafer further comprises dicing the handle substrate to form a diced-handle substrate such that the discrete component is releasably attached to the handle substrate.

70. The method of claim 66 in which the release layer comprises one or more of a thermally sensitive material and an ultraviolet light sensitive material.

72. The method of claim 66 in which the release layer comprises multiple layers, wherein a first layer of the multiple layers is permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV sensitive.

83. The method of claim 65 further comprising depositing the discrete component onto the device substrate and releasing the discrete component from the handle substrate.

84. The method of claim 83 in which depositing the discrete component onto the device substrate comprises interconnecting the discrete component to the device substrate.

85. The method of claim 84 in which releasing the discrete component from the handle is at least partially contemporaneous with interconnecting the discrete component to the device substrate.

86. The method of claim 84 in which releasing the discrete component from the handle is in response to or caused by the interconnecting of the discrete component to the device substrate.

154. The method of claim 65 comprising thinning a wafer to form the ultra-thin wafer.

69. (canceled)

71. (canceled)

73-82. -82. (canceled)

87-89. -89. (canceled)

91-133. -133. (canceled)

134. A method comprising:

using a releasable layer to attach a handle substrate to a discrete component,

while the handle substrate is attached to the discrete component, using a tool to hold the handle substrate and cause the discrete component to contact an adhesive layer on the device substrate, and

causing the releasable layer to release the handle substrate from the discrete component and causing the discrete component to become attached to the device substrate at the adhesive layer.

137. The method of claim 134 in which the releasable layer comprises a thermally sensitive material, and in which the thermal sensitivity of the release layer causes a change in an adhesive strength of the release layer in response to an application of thermal energy.

138. The method of claim 134 in which the releasable layer comprises an ultraviolet light sensitive material, and in which the ultraviolet light sensitivity of the release layer causes a change in an adhesive strength of the release layer in response to an application of an ultraviolet light.

139. The method of claim 134 in which the releasable layer comprises multiple layers, wherein a first layer of the multiple layers is a permanent adhesive and a second layer of the multiple layers is one or more of thermally sensitive and UV sensitive.

149. The method of claim 134 in which releasing the discrete component from the handle is at least partially contemporaneous with attaching the discrete component to the device substrate.

150. The method of claim 134 in which the releasing of the discrete component from the handle and the interconnecting of the discrete component to the device substrate are in response to a common trigger.

135. (canceled)

136. (canceled)

140-148. -148. (canceled)

151-153. -153. (canceled)