TRENCH POWER SEMICONDUCTOR DEVICE

• US 20170365708A1
• Filed: 06/20/2016
• Published: 12/21/2017
• Est. Priority Date: 06/20/2016
• Status: Active Grant

• Current Assignee: Sinopower Semiconductor, Inc.
• Original Assignee: Sinopower Semiconductor, Inc.
• Inventors: LI, PO-HSIEN, LIN, WEI-CHIEH, LIN, JIA-FU, YANG, GUO-LIANG
• Granted Patent: US 9,991,378 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 29/0696 of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
• CPC Class Codes: H01L 29/1095 Body region, i.e. base region, of DMOS transistors or IGBTs cell layout H01L29/0696
• CPC Class Codes: H01L 29/407 Recessed field plates, e.g. trench field plates, buried field plates
• CPC Class Codes: H01L 29/41766 with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor H01L29/41733 - H01L29/41758 take precedence
• CPC Class Codes: H01L 29/42376 characterised by the length or the sectional shape
• CPC Class Codes: H01L 29/66734 with a step of recessing the gate electrode, e.g. to form a trench gate electrode
• CPC Class Codes: H01L 29/7806 the other device being a Schottky barrier diode
• CPC Class Codes: H01L 29/7811 with an edge termination structure guard regions per se H01L29/0619; field plates per se H01L29/402
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236
• CPC Class Codes: H01L 29/872 Schottky diodes

Abstract

A trench power semiconductor device is provided. A trench gate structure of the trench power semiconductor device located in a cell trench of an epitaxial layer includes a first dielectric layer, a second dielectric layer, a gate electrode, a third dielectric layer, and a shielding layer. The second dielectric layer is interposed between the first and third dielectric layers, and the second dielectric layer is made from different material than the first dielectric layer. After performing a selective etching step on the second dielectric layer, a recess can be formed among the first, second and third dielectric layers. The gate electrode includes a conductive layer formed in the recess region, and the shielding electrode is surrounded by the third dielectric layer and insulated from the conductive layer.

Claims

1. A trench power semiconductor device comprising:

a substrate;

an epitaxial layer formed on the substrate, wherein the epitaxial layer has at least one cell trench formed therein; and

a trench gate structure arranged in the cell trench, wherein the trench gate structure comprises;

a shielding electrode arranged in the cell trench;

a first dielectric layer formed in the cell trench and having a contour substantially similar to that of an inner wall surface of the cell trench, wherein the first dielectric layer has a first upper inner wall and a lower inner wall connected to the first upper inner wall;

a second dielectric layer covering the lower inner wall, wherein the second dielectric layer is made from a different material than the first dielectric layer;

a gate electrode arranged in the cell trench, wherein the gate electrode includes a first conductive layer covering the first upper inner wall, and the first conductive layer has a bottom end connected to a first ending surface of the second dielectric layer; and

a third dielectric conformingly covering inner surfaces of the first conductive layer and the second dielectric layer, wherein the third dielectric surrounds the shielding electrode so as to isolate the shielding electrode from the gate electrode;

wherein an entire thickness of the first conductive layer in a direction parallel to a surface of the epitaxial layer is substantially the same as an entire thickness of the second dielectric layer in a direction parallel to a surface of the epitaxial layer.

2. The trench power semiconductor device according to claim 1, further comprising a body region and a source region, wherein the body region and the source region are formed in the epitaxial layer, the body region surrounds the cell trench, and the source region is located above the body region.

3. The trench power semiconductor device according to claim 2, wherein the first ending surface is located at a level equal to or lower than a lowest edge of the body region.

5. The trench power semiconductor device according to claim 1, wherein the first dielectric layer has a second upper inner wall facing to the first upper inner wall and connected to the lower inner wall, the gate electrode further includes a second conductive layer covering the second upper inner wall and disposed facing to the first conductive layer, and the second conductive layer has a bottom end connected to a second ending surface of the second dielectric layer.

6. The trench power semiconductor device according to claim 5, wherein part of the shielding electrode is disposed overlapping with the first conductive layer and the second conductive layer.

7. The trench power semiconductor device according to claim 5, wherein the shielding electrode does not overlap with either the first conductive layer or the second conductive layer.

8. The trench power semiconductor device according to claim 5, wherein the gate electrode further includes a third conductive layer extending between the first conductive layer and the second conductive layer, and the third conductive layer is located over and insulated from the shielding electrode.

9. The trench power semiconductor device according to claim 1, further comprising a terminal electrode structure, wherein the epitaxial layer has at least one termination trench formed therein, the terminal electrode structure is disposed in the termination trench, and the terminal electrode structure includes:

a terminal electrode arranged in the termination trench; and

a terminal dielectric layer covering an inner wall surface of the termination trench and having a contour substantially similar to a contour of the inner wall surface of the termination trench, wherein the terminal dielectric layer includes a first insulating layer, a second insulating layer and a third insulating layer sequentially stacked on the inner wall surface of the termination trench, the second insulating layer is made from a different material than the first insulating layer, and the terminal electrode is insulated from the epitaxial layer through the terminal dielectric layer.

10. The trench power semiconductor device according to claim 9, wherein the terminal electrode extends from an upper portion of the termination trench to a lower portion of the termination trench.

11. The trench power semiconductor device according to claim 9, wherein a top of the terminal electrode is located at a level lower than or equal to an end face of the second insulating layer.

12. The trench power semiconductor device according to claim 9, further comprising a conductive layer, wherein an end face of the second insulating layer is located lower than a top surface of the first insulating layer and a top surface of the third insulating layer to define a recess among the first, second, and third insulating layers, and the conductive layer is arranged in the recess and has a thickness substantially the same as a thickness of the second insulating layer.

13. The trench power semiconductor device according to claim 1, further comprising:

an interlayer dielectric layer disposed on the epitaxial layer and covering the cell trench, wherein the interlayer dielectric layer has at least one schottky contact opening; and

a conductive plug penetrating the interlayer dielectric layer, wherein the conductive plug is electrically connected to the epitaxial layer through the schottky contact opening to form a schottky diode.

4. (canceled).

14. A trench power semiconductor device comprising:

a substrate;

an epitaxial layer disposed on the substrate and having at least one termination trench formed therein; and

a terminal electrode structure arranged in the termination trench, wherein the terminal electrode structure includes;

a terminal dielectric layer having a contour substantially similar to a contour of an inner wall surface of the termination trench, wherein the terminal dielectric layer includes a first insulating layer, a second insulating layer and a third insulating layer sequentially stacked on the inner wall surface of the termination trench, the second insulating layer is made from a different material than the third insulating layer, and an end face of the second insulating layer is located lower than a top surface of the first insulating layer and a top surface of the third insulating layer to define a recess among the first, second, and third insulating layers;

a conductive layer arranged in the recess, wherein an entire thickness of the conductive layer in a direction parallel to a surface of the epitaxial layer is substantially the same as an entire thickness of the second insulating layer in a direction parallel to a surface of the epitaxial layer; and

a terminal electrode arranged in the termination trench and isolated from the conductive layer by the third insulating layer.

15. The trench power semiconductor device according to claim 14, wherein a top of the terminal electrode is located at a level lower than or equal to the end face of the second insulating layer.

16. The trench power semiconductor device according to claim 14, wherein part of the terminal electrode overlaps with the conductive layer.

17. The trench power semiconductor device according to claim 14, wherein the terminal electrode does not overlap with the conductive layer.