ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT DEVICE

• US 20170372972A1
• Filed: 08/28/2017
• Published: 12/28/2017
• Est. Priority Date: 03/26/2015
• Status: Abandoned Application

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: USAMI, Yoshihisa
• Application Number:
  US15/687,777
• Publication Number:
  US 20170372972A1
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/76892 modifying the pattern
• CPC Class Codes: H01L 21/823475 interconnection or wiring or contact manufacturing related aspects
• CPC Class Codes: H01L 21/8238 Complementary field-effect transistors, e.g. CMOS
• CPC Class Codes: H01L 21/823871 interconnection or wiring or contact manufacturing related aspects
• CPC Class Codes: H01L 23/522 including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• CPC Class Codes: H01L 27/088 the components being field-effect transistors with insulated gate
• CPC Class Codes: H01L 27/092 complementary MIS field-effect transistors
• CPC Class Codes: H01L 27/0928 comprising both N- and P- wells in the substrate, e.g. twin-tub
• CPC Class Codes: H01L 29/786 Thin film transistors, i.e. transistors with a channel being at least partly a thin film transistors having only the source or the drain region on an insulator layer H01L29/0653; thin film FinFETs H01L29/785
• CPC Class Codes: H10K 10/40 Organic transistors
• CPC Class Codes: H10K 99/00 Subject matter not provided for in other groups of this subclass

Abstract

An electronic circuit device includes a plurality of logic circuit elements which output an output signal by performing a preset operation on an input signal. Transistors constituting the logic circuit elements each have a gate electrode provided on a substrate, an insulating layer electrically insulating the gate electrode, a source electrode, a drain electrode, and a semiconductor layer. Input signal wiring, to which the input signal is applied, is connected to the gate electrode and provided inside the insulating layer on the substrate. Output signal wiring, from which the output signal is taken out, is connected to the source electrode or the drain electrode and provided inside the insulating layer on the substrate. An electronic circuit performing a preset processing is constituted with the plurality of logic circuit elements.

Claims

1. An electronic circuit device comprising:

a plurality of logic circuit elements which are constituted with transistors and outputs an output signal by performing a preset operation on an input signal,

wherein the transistors each have a gate electrode provided on a substrate, an insulating layer electrically insulating the gate electrode, a source electrode, a drain electrode, and a semiconductor layer,

input signal wiring, to which the input signal is applied, is connected to the gate electrode and provided inside the insulating layer on the substrate,

output signal wiring, from which the output signal is taken out, is connected to the source electrode or the drain electrode and provided inside the insulating layer on the substrate, and

an electronic circuit performing a preset processing is constituted with the plurality of logic circuit elements.

2. The electronic circuit device according to claim 1,

wherein at least one connection wiring, which connects the input signal wiring of one of the logic circuit elements to the output signal wiring of another logic circuit elements is provided on the insulating layer such that the plurality of logic circuit elements are connected to each other.

3. The electronic circuit device according to claim 2,

wherein the connection wiring is electrically connected to the input signal wiring and the output signal wiring through a conductive member formed in the insulating layer.

4. The electronic circuit device according to claim 2,

wherein the input signal wiring and the output signal wiring are disposed in parallel to each other, and

the connection wiring is disposed crossing the input signal wiring and the output signal wiring.

5. The electronic circuit device according to claim 1,

wherein the semiconductor layer is constituted with an organic semiconductor or an inorganic semiconductor.

6. The electronic circuit device according to claim 1,

wherein each of the transistors is a combination of a P-type transistor and an N-type transistor.

7. The electronic circuit device according to claim 2,

wherein among the plurality of logic circuit elements, some logic circuit elements are selectively connected to each other by using the connection wiring.

14. The electronic circuit device according to claim 3,

wherein the input signal wiring and the output signal wiring are disposed in parallel to each other, and

the connection wiring is disposed crossing the input signal wiring and the output signal wiring.

15. The electronic circuit device according to claim 2,

wherein the semiconductor layer is constituted with an organic semiconductor or an inorganic semiconductor.

16. The electronic circuit device according to claim 2,

wherein each of the transistors is a combination of a P-type transistor and an N-type transistor.

8. A method for manufacturing an electronic circuit device which includes a plurality of logic circuit elements constituted with transistors and outputting an output signal by performing a preset operation on an input signal and in which an electronic circuit performing a preset processing is constituted with the plurality of logic circuit elements, the transistors each have a gate electrode provided on a substrate, an insulating layer electrically insulating the gate electrode, a source electrode, a drain electrode, and a semiconductor layer, input signal wiring, to which the input signal is applied, is connected to the gate electrode and provided inside the insulating layer on the substrate, output signal wiring, from which the output signal is taken out, is connected to the source electrode or the drain electrode and provided inside the insulating layer on the substrate, and at least one connection wiring crossing the plurality of logic circuit elements is provided on the insulating layer such that the plurality of logic circuit elements are connected to each other, the method comprising:

a step of selecting the logic circuit elements to be connected from the plurality of logic circuit elements;

a step of exposing the input signal wiring by forming a contact hole in the connection wiring and the insulating layer at an intersection point between the input signal wiring of the selected logic circuit elements and the connection wiring;

a step of exposing the output signal wiring by forming a contact hole in the connection wiring and the insulating layer at an intersection point between the output signal wiring of the logic circuit elements and the connection wiring; and

a step of electrically connecting the input signal wiring to the connection wiring and the output signal wiring to the connection wiring by filling each contact hole with a conductive member.

10. The method for manufacturing an electronic circuit device according to claim 8,

wherein the input signal wiring and the output signal wiring are disposed in parallel to each other, and

the connection wiring is disposed crossing the input signal wiring and the output signal wiring.

11. The method for manufacturing an electronic circuit device according to claim 8,

wherein the step of selecting the logic circuit elements to be connected includes a step of selecting logic circuit elements which can perform a preset operation by inspecting the plurality of logic circuit elements and selecting logic circuit elements which will constitute the electronic circuit from the selected logic circuit elements.

12. The method for manufacturing an electronic circuit device according to claim 8,

wherein the semiconductor layer is constituted with an organic semiconductor or an inorganic semiconductor.

13. The method for manufacturing an electronic circuit device according to claim 8,

wherein each of the transistors is a combination of a P-type transistor and an N-type transistor.

9. A method for manufacturing an electronic circuit device which includes a plurality of logic circuit elements constituted with transistors and outputting an output signal by performing a preset operation on an input signal and in which an electronic circuit performing a preset processing is constituted with the plurality of logic circuit elements, the transistors each have a gate electrode provided on a substrate, an insulating layer electrically insulating the gate electrode, a source electrode, a drain electrode, and a semiconductor layer, input signal wiring, to which the input signal is applied, is connected to the gate electrode and provided inside the insulating layer on the substrate, output signal wiring, from which the output signal is taken out, is connected to the source electrode or the drain electrode and provided inside the insulating layer on the substrate, the method comprising:

a step of selecting the logic circuit elements to be connected from the plurality of logic circuit elements;

a step of exposing the output signal wiring by forming a contact hole in the insulating layer on the output signal wiring of the selected logic circuit elements;

a step of exposing the input signal wiring by forming a contact hole in the insulating layer on the input signal wiring of the logic circuit elements into which the output signal of the selected logic circuit elements is input; and

a step of forming the connection wiring electrically connecting the input signal wiring to the output signal wiring by filling each contact hole with a conductive member.

17. The method for manufacturing an electronic circuit device according to claim 9,

wherein the input signal wiring and the output signal wiring are disposed in parallel to each other, and

the connection wiring is disposed crossing the input signal wiring and the output signal wiring.

18. The method for manufacturing an electronic circuit device according to claim 9,

wherein the step of selecting the logic circuit elements to be connected includes a step of selecting logic circuit elements which can perform a preset operation by inspecting the plurality of logic circuit elements and selecting logic circuit elements which will constitute the electronic circuit from the selected logic circuit elements.

19. The method for manufacturing an electronic circuit device according to claim 9,

wherein the semiconductor layer is constituted with an organic semiconductor or an inorganic semiconductor.

20. The method for manufacturing an electronic circuit device according to claim 9,

wherein each of the transistors is a combination of a P-type transistor and an N-type transistor.