CONDUCTIVE TERMINAL ON INTEGRATED CIRCUIT

• US 20170372999A1
• Filed: 09/25/2016
• Published: 12/28/2017
• Est. Priority Date: 06/27/2016
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Lai, Yu-Chia, Yu, Chen-Hua, Huang, Chang-Pin, Liu, Chung-Shi, Tu, Hsien-Ming, Kuo, Hung-Yi, Tsai, Hao-Yi, Liang, Shih-Wei, Liu, Ren-Xuan
• Granted Patent: US 9,852,985 B1
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/03009 for protecting parts during manufacture
• CPC Class Codes: H01L 2224/0392 specifically adapted to include a probing step
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05088 Shape of the additional element
• CPC Class Codes: H01L 2224/05096 Uniform arrangement, i.e. array
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05541 Structure
• CPC Class Codes: H01L 2224/05555 being circular or elliptic
• CPC Class Codes: H01L 2224/05557 comprising protrusions or indentations
• CPC Class Codes: H01L 2224/05558 conformal layer on a patterned surface
• CPC Class Codes: H01L 2224/05582 Two-layer coating
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 23/3171 the coating being directly applied to the semiconductor body, e.g. passivation layer H01L23/3178 takes precedence
• CPC Class Codes: H01L 23/5226 Via connections in a multilevel interconnection structure
• CPC Class Codes: H01L 23/528 Geometry or layout of the interconnection structure H01L27/0207 takes precedence; algorithms G06F30/00
• CPC Class Codes: H01L 24/03 Manufacturing methods
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 2924/206 : Length ranges

Abstract

A conductive terminal on an integrated circuit is provided. The conductive terminal includes a conductive pad, a dielectric layer, and a conductive via. The conductive pad is disposed on and electrically to the integrated circuit. The dielectric layer covers the integrated circuit and the conductive pad, the dielectric layer includes a plurality of contact openings arranged in array, and the conductive pad is partially exposed by the contact openings. The conductive via is disposed on the dielectric layer and electrically connected to the conductive pad through the contact openings. The conductive via includes a plurality of convex portions arranged in array. The convex portions are distributed on a top surface of the conductive via, and the convex portions are corresponding to the contact openings.

Claims

1. A conductive terminal on an integrated circuit, comprising:

a conductive pad disposed on and electrically to the integrated circuit;

a dielectric layer covering the integrated circuit and the conductive pad, the dielectric layer comprising a plurality of contact openings arranged in array, and the conductive pad being partially exposed by the contact openings; and

a conductive via disposed on the dielectric layer and electrically connected to the conductive pad through the contact openings, the conductive via comprising a plurality of convex portions arranged in array, the conductive via comprising a plurality of first conductive portions embedded in the contact openings and a second conductive portion connected to the first conductive portions, the second conductive portion covering the first conductive portions and the dielectric layer, the second conductive portion comprising a plurality of first segments and a second segment connected to the first segments, the first segments covering the first conductive portions, the second segment covering the dielectric layer, a maximum thickness of each of the first segments being greater than a maximum thickness of the second segment, and the convex portions being distributed on top surfaces of the first segments.

2. The conductive terminal as claimed in claim 1, wherein each of the convex portions is distributed right above one of the contact openings.

3. The conductive terminal as claimed in claim 1, wherein the conductive via are cylindrical conductive vias, the contact openings are circular contact openings, a diameter of each of the contact openings ranges from about 8 micrometers to about 10 micrometers, a spacing between two of the contact openings adjacent to each other ranges from about 3 micrometers to about 5 micrometers, and a diameter of a circular area occupied by the conductive via ranges from about 45 micrometers to about 50 micrometers.

4. The conductive terminal as claimed in claim 1, wherein an area of the convex portions ranges from about 15.8% to about 20% of an area occupied by the conductive via.

5. The conductive terminal as claimed in claim 1 further comprising a conductive cap conformally covering a top surface of the second conductive portion of the conductive via.

6. The conductive terminal as claimed in claim 5, wherein the conductive cap comprises a solder cap.

7. A conductive terminal on an integrated circuit, comprising:

a conductive pad disposed on and electrically to the integrated circuit;

a dielectric layer covering the integrated circuit and the conductive pad, the dielectric layer comprising a plurality of arc-shaped contact openings, and the conductive pad being partially exposed by the arc-shaped contact openings; and

a conductive via disposed on the dielectric layer and electrically connected to the conductive pad through the arc-shaped contact openings, the conductive via comprising a plurality of convex portions, the convex portions being distributed on a top surface of the conductive via, and the convex portions being corresponding to the dielectric layer covered by the conductive via, wherein the arc-shaped contact openings are separated from one another and arranged along a circular path, and a center of circle of the circular path is substantially aligned with a center of the conductive via.

8. The conductive terminal as claimed in claim 7, wherein each of the convex portions is distributed right above one of the dielectric layer covered by the conductive via.

9. The conductive terminal as claimed in claim 7, wherein the conductive via comprises a plurality of first conductive portions embedded in the arc-shaped contact openings and a second conductive portion connected to the first conductive portions, and the second conductive portion covers the first conductive portions and the dielectric layer.

10. The conductive terminal as claimed in claim 9, wherein the convex portions are distributed on a top surface of the second conductive portion.

11. The conductive terminal as claimed in claim 7 further comprising a conductive cap conformally covering the top surface of the conductive via.

12. The conductive terminal as claimed in claim 7, wherein an area of the convex portions ranges from about 74.7% to about 80% of an area occupied by the conductive via.

13. A conductive terminal on an integrated circuit, comprising:

a conductive pad disposed on and electrically to the integrated circuit;

a dielectric layer covering the integrated circuit and the conductive pad, the dielectric layer comprising a ring-shaped contact opening, and the conductive pad being partially exposed by the ring-shaped contact opening; and

a conductive via disposed on the dielectric layer and electrically connected to the conductive pad through the ring-shaped contact opening, the conductive via comprising at least one convex portion, the at least one convex portion being distributed on a top surface of the conductive via, and the at least one convex portion being corresponding to the dielectric layer covered by the conductive via, wherein an area of the at least one convex portion ranges from about 39% to about 75% of an area occupied by the conductive via.

14. The conductive terminal as claimed in claim 13, wherein the at least one convex portion is above the dielectric layer covered by the conductive via.

15. The conductive terminal as claimed in claim 13, wherein the conductive via comprises a ring-shaped conductive portions embedded in the ring-shaped contact opening and a circular conductive portion covering the ring-shaped conductive portion and a part of the dielectric layer surrounded by the ring-shaped conductive portion.

16. The conductive terminal as claimed in claim 15, wherein the at least one convex portion is distributed on a top surface of the circular conductive portion.

17. The conductive terminal as claimed in claim 13 further comprising a conductive cap conformally cover the top surface of the conductive via.

18. The conductive terminal as claimed in claim 13, wherein a width of the ring-shaped contact opening ranges from about 5 micrometers to about 10 micrometers and a diameter of a circular area occupied by the conductive via ranges from about 45 micrometers to about 50 micrometers.

19. The conductive terminal as claimed in claim 13, wherein the dielectric layer comprises a circular dielectric island surrounded by the ring-shaped contact opening, and the circular dielectric island partially covers the conductive pad.

20. The conductive terminal as claimed in claim 19, wherein an area of the conductive via is substantially equal to or greater than a total area of the circular dielectric island and the ring-shaped contact opening.