STRUCTURE AND METHOD FOR HYBRID OPTICAL PACKAGE WITH GLASS TOP COVER

• US 20180006003A1
• Filed: 04/26/2017
• Published: 01/04/2018
• Est. Priority Date: 06/29/2016
• Status: Active Grant

• Current Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Original Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Inventors: NAGARAJAN, KUMAR, ANKIREDDI, SESHASAYEE S.
• Granted Patent: US 10,461,066 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052
• CPC Class Codes: H01L 31/1892 methods involving the use of temporary, removable substrates

Abstract

An optical package containing optical sensor/detector pairs co-housed with a non-optical sensor and processes for fabricating the optical package are described herein. Traditional package structures require the use of clear mold compounds to protect the sensitive dies, but such compounds degrade with time and temperature. The optical package described herein uses a special glass top cover that is transparent in the entire electro-magnetic spectral region required by the contained dies.

Claims

1. An optical package, comprising:

a package substrate;

an application specific integrated circuit die disposed on the package substrate, the application specific integrated circuit die including a detector;

at least one non-optical sensor die disposed on the package substrate;

a pre-molded polymer panel unit cell disposed on the package substrate, the pre-molded polymer panel unit cell including at least one cavity and at least one sidewall, the at least one sidewall configured to restrict cross talk between the application specific integrated circuit and the at least one non-optical sensor die; and

a glass cover disposed on the pre-molded polymer panel unit cell.

2. The optical package of claim 1, wherein the package substrate includes at least one vent hole extending through the package substrate.

3. The optical package of claim 1, wherein the package substrate comprises a laminate.

4. The optical package of claim 1, wherein the package substrate comprises a ceramic.

5. The optical package of claim 1, further comprising:

at least one pedestal, where at least one of the application specific integrated circuit die or the at least one non-optical sensor die is disposed on the at least one pedestal.

6. The optical package of claim 5, wherein the at least one pedestal includes a spacer die.

7. The optical package of claim 1, further comprising:

a first adhesive film element that is disposed between the pre-molded polymer panel unit cell and the package substrate.

8. The optical package of claim 1, further comprising:

a second adhesive film element that is disposed between the pre-molded polymer panel unit cell and the glass cover.

9. A process for fabricating an optical package, comprising:

placing an application specific integrated circuit die on a panel level substrate;

placing at least one non-optical sensor die on the panel level substrate;

bonding a pre-molded polymer panel to the panel level substrate; and

bonding at least one glass cover to the pre-molded polymer panel.

10. The process for fabricating the optical package of claim 9, wherein the panel level substrate includes at least one vent hole extending through the panel level substrate.

11. The process for fabricating the optical package of claim 9, wherein the package substrate comprises a laminate.

12. The process for fabricating the optical package of claim 9, wherein the package substrate comprises a ceramic.

13. The process for fabricating the optical package of claim 9, further comprising:

placing at least one of the application specific integrated circuit die or the at least one non-optical sensor die on at least one pedestal.

14. The process for fabricating the optical package of claim 9, further comprising:

placing the least one non-optical sensor die on the application specific integrated circuit die.

15. The process for fabricating the optical package of claim 9, further comprising:

singulating the optical package from the panel level substrate.

16. A process for fabricating an optical package, comprising:

placing an application specific integrated circuit die on a panel level substrate, the panel level substrate including at least one vent hole;

placing at least one non-optical sensor die on the panel level substrate;

placing a first adhesive film element on the panel level substrate;

placing a pre-molded polymer panel on the first adhesive film element;

placing a second adhesive film element on the pre-molded polymer panel;

placing at least one glass cover on the second adhesive film element; and

curing the first adhesive film element and the second adhesive film element.

17. The process for fabricating the optical package in claim 16, wherein the panel level substrate includes at least one vent hole.

18. The process for fabricating the optical package in claim 16, further comprising:

singulating the optical package from the panel level substrate.

19. The process for fabricating the optical package of claim 16, wherein the package substrate comprises a laminate.

20. The process for fabricating the optical package of claim 16, wherein the package substrate comprises a ceramic.