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STRUCTURE AND METHOD FOR HYBRID OPTICAL PACKAGE WITH GLASS TOP COVER

  • US 20180006003A1
  • Filed: 04/26/2017
  • Published: 01/04/2018
  • Est. Priority Date: 06/29/2016
  • Status: Active Grant
First Claim
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1. An optical package, comprising:

  • a package substrate;

    an application specific integrated circuit die disposed on the package substrate, the application specific integrated circuit die including a detector;

    at least one non-optical sensor die disposed on the package substrate;

    a pre-molded polymer panel unit cell disposed on the package substrate, the pre-molded polymer panel unit cell including at least one cavity and at least one sidewall, the at least one sidewall configured to restrict cross talk between the application specific integrated circuit and the at least one non-optical sensor die; and

    a glass cover disposed on the pre-molded polymer panel unit cell.

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