POWER MODULE

• US 20180007815A1
• Filed: 09/15/2017
• Published: 01/04/2018
• Est. Priority Date: 11/28/2014
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Liu, Chun-Kai, Chao, Yu-Lin
• Granted Patent: US 10,492,344 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/07 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars
• CPC Class Codes: H05K 7/20918 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

Claims

1. A power module, comprising:

a plurality of substrates, located on different planes and surrounding an axis, wherein each of the substrates extends along the axis;

a plurality of power devices, disposed on the substrates respectively and electrically connected with each other; and

a heat dissipation assembly, disposed on the substrates and opposite to the power devices, wherein the heat dissipation assembly comprises a plurality of heat dissipation fins extending from each of the substrates away from the power devices, wherein an extending length of the heat dissipation fins gradually increases from two sides of each of the substrates towards the middle of each of the substrates, and heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

2. The power module as recited in claim 1, wherein the substrates surround the axis to form a closed contour, the power devices are located outside the closed contour, and the heat dissipation assembly is located inside the closed contour.

3. The power module as recited in claim 2, wherein the closed contour is a polygon.

4. The power module as recited in claim 2, wherein the substrates form a columnar structure having openings on both ends, and the closed contour is a cross-section contour of the columnar structure.

5. The power module as recited in claim 2, wherein an electronic apparatus is adapted for being disposed on the closed contour.

6. The power module as recited in claim 1, wherein the substrates are symmetrical with respect to the axis.

7. The power module as recited in claim 1, wherein each of the substrates is divided into two ends along the axis, and the heat dissipation assembly further comprises a fan that is disposed on at least one end of the substrates.

8. The power module as recited in claim 1, wherein the substrates are electrically connected by a substrate interconnection structure.

9. The power module as recited in claim 8, wherein the substrate interconnection structure is a metal wire.

10. The power module as recited in claim 8, wherein the substrate interconnection structure is a flexible printed circuit board.