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CMOS-MEMS-CMOS PLATFORM

  • US 20180009654A1
  • Filed: 09/21/2017
  • Published: 01/11/2018
  • Est. Priority Date: 06/12/2015
  • Status: Active Grant
First Claim
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1. A sensor chip comprising:

  • a first substrate with a first surface and a second surface comprising at least one CMOS circuit;

    a first MEMS substrate with a first surface and a second surface on opposing sides of the first MEMS substrate;

    a second substrate;

    a second MEMS substrate; and

    a third substrate comprising at least one CMOS circuit;

    wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the first MEMS substrate; and

    wherein the second surface of the first MEMS substrate is attached to the second substrate; and

    wherein the first substrate, the first MEMS substrate, the second substrate and the packaging substrate are provided with electrical inter-connects.

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