FIBER-TO-WAVEGUIDE COUPLERS WITH ULTRA HIGH COUPLING EFFICIENCY AND INTEGRATED CHIP WAVEGUIDES INCLUDING THE SAME

• US 20180011249A1
• Filed: 07/11/2017
• Published: 01/11/2018
• Est. Priority Date: 07/11/2016
• Status: Abandoned Application

• Current Assignee: University of Maryland, College Park
• Original Assignee: University of Maryland
• Inventors: Zhu, Tiecheng, Dagenais, Mario, Veilleux, Sylvain
• Application Number:
  US15/646,814
• Publication Number:
  US 20180011249A1
• Time in Patent Office: Days
• CPC Class Codes: G02B 2006/02166 Methods of designing the gratings, i.e. calculating the structure, e.g. algorithms, numerical methods
• CPC Class Codes: G02B 2006/12107 Grating
• CPC Class Codes: G02B 6/02076 Refractive index modulation gratings, e.g. Bragg gratings
• CPC Class Codes: G02B 6/02085 characterised by the grating profile, e.g. chirped, apodised, tilted, helical
• CPC Class Codes: G02B 6/02123 characterised by the method of manufacture of the grating photolithography G03F7/0005
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/124 Geodesic lenses or integrated gratings
• CPC Class Codes: G02B 6/305 and having an integrated mode-size expanding section, e.g. tapered waveguide
• CPC Class Codes: G02B 6/36 Mechanical coupling means G02B6/255, G02B6/42 take precedence

Abstract

An easy-to-fabricate and highly efficient single-mode optical fiber-to-single-mode optical waveguide coupler having relatively large horizontal and vertical alignment tolerances between the fiber and the waveguide coupler. The waveguide coupler also features ease of end-facet cleaving. The waveguide coupler can be used in ultra-broadband high coupling efficiency applications or other suitable applications. Single-mode on-chip waveguides incorporating such coupler(s) are also provided, as are methods of manufacturing the waveguide coupler and on-chip waveguide.

Claims

1. A coupler for coupling a single-mode optical fiber to a single-mode on-chip optical waveguide, comprising:

a loosely-confined straight waveguide portion defining a first end configured for positioning adjacent an optical fiber, and a second end; and

an adiabatic waveguide mode-converter extending from a first end thereof at the second end of the loosely-confined straight waveguide portion to a second end thereof, the second end of the adiabatic waveguide mode-converter configured for positioning adjacent a more-confined waveguide core, the adiabatic waveguide converter tapering from the second end to the first end thereof and configured to serve as a transition between the loosely-confined straight waveguide portion and the more-confined waveguide core.

2. The coupler according to claim 1, wherein the coupler exhibits a coupling efficiency of at least 96%.

3. The coupler according to claim 1, wherein the loosely-confined straight waveguide portion maintains efficiency within a cleave position range of ±

200 μ

m.

4. The coupler according to claim 1, wherein the coupler defines at least one of a vertical alignment tolerance or a horizontal alignment tolerance of at least 3.8 μ

m.

5. The coupler according to claim 1, wherein the loosely-confined straight waveguide portion and the adiabatic waveguide mode-converter are formed from Si3N4.

6. The coupler according to claim 5, wherein the loosely-confined straight waveguide portion and the adiabatic waveguide mode-converter are disposed between top and bottom SiO2 cladding layers.

7. The coupler according to claim 6, wherein the bottom SiO2 cladding layer is disposed on an Si substrate.

8. An integrated chip single-mode optical waveguide, comprising:

a more-confined waveguide core; and

a first coupler disposed at an end of the more-confined waveguide core, the first coupler including;

a loosely-confined straight waveguide portion defining a first end configured for positioning adjacent an input optical fiber, and a second end; and

an adiabatic waveguide mode-converter extending from a first end thereof at the second end of the loosely-confined straight waveguide portion to a second end thereof at an end of the more-confined waveguide core, the adiabatic waveguide converter tapering from the second end to the first end thereof and configured to serve as a transition between the loosely-confined straight waveguide portion and the more-confined waveguide core.

9. The integrated chip single-mode optical waveguide according to claim 8, wherein the first coupler exhibits a coupling efficiency of at least 96%.

10. The integrated chip single-mode optical waveguide according to claim 8, wherein the loosely-confined straight waveguide portion maintains efficiency within a cleave position range of +200 μ

m.

11. The integrated chip single-mode optical waveguide according to claim 8, wherein the first coupler defines at least one of a vertical alignment tolerance or a horizontal alignment tolerance of at least 3.8 μ

m.

12. The integrated chip single-mode optical waveguide according to claim 8, wherein the waveguide core and the first coupler are formed from Si3N4.

13. The integrated chip single-mode optical waveguide according to claim 12, wherein the waveguide core and the first coupler are disposed between top and bottom SiO2 cladding layers.

14. The integrated chip single-mode optical waveguide according to claim 13, wherein the bottom SiO2 cladding layer is disposed on an Si substrate.

15. The integrated chip single-mode optical waveguide according to claim 8, further comprising a second coupler disposed at an opposite end of the waveguide core, the second coupler including:

a loosely-confined straight waveguide portion defining a first end configured for positioning adjacent an output optical fiber, and a second end; and

an adiabatic waveguide mode-converter extending from a first end thereof at the second end of the loosely-confined straight waveguide portion to a second end thereof at the opposite end of the more-confined waveguide core, the adiabatic waveguide converter tapering from the second end to the first end thereof and configured to serve as a transition between the loosely-confined straight waveguide portion and the more-confined waveguide core.

16. A system, comprising:

an input optical fiber;

an output optical fiber; and

an integrated chip single-mode optical waveguide disposed between the input optical fiber and the output optical fiber, the integrated chip single-mode optical waveguide including;

a more-confined waveguide core; and

first and second couplers, the first coupler disposed between the input optical fiber and the more-confined waveguide core and the second coupler disposed between the output optical fiber and the more-confined waveguide core, each of the first and second couplers including;

a loosely-confined straight waveguide portion defining a first end configured for positioning adjacent the corresponding optical fiber, and a second end; and

an adiabatic waveguide mode-converter extending from a first end thereof at the second end of the loosely-confined straight waveguide portion to a second end thereof at a corresponding end of the more-configured waveguide core, the adiabatic waveguide converter tapering from the second end to the first end thereof and configured to serve as a transition between the loosely-confined straight waveguide portion and the more-confined waveguide core.

17. The system according to claim 16, wherein each coupler exhibits a coupling efficiency of at least 96%.

18. The system according to claim 16, wherein the loosely-confined straight waveguide portions of the first and second couplers maintain efficiency within a cleave position range of ±

200 μ

m.

19. The system according to claim 16, wherein the first and second couplers defines at least one of a vertical alignment tolerance or a horizontal alignment tolerance of at least 3.8 μ

m relative to the corresponding optical fiber disposed adjacent thereto.

20. The system according to claim 16, wherein:

the waveguide core and the first and second couplers are formed from Si3N4,

the waveguide core and the first and second couplers are disposed between top and bottom SiO2 cladding layers; and

the bottom SiO2 cladding layer is disposed on an Si substrate.