COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME

• US 20180012696A1
• Filed: 03/28/2017
• Published: 01/11/2018
• Est. Priority Date: 07/07/2016
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: LEE, Sang Jong, JANG, Su Bong, JUNG, Min Ki, KIM, Han
• Granted Patent: US 10,490,349 B2
• Time in Patent Office: Days
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 2017/0073 with a special conductive pattern, e.g. flat spiral
• CPC Class Codes: H01F 41/043 by thick film techniques

Abstract

A coil component includes a body including a plurality of first and second coil patterns, which are alternately disposed, and insulating layers disposed therebetween. The first coil patterns may be connected to the second coil patterns adjacent to the first coil patterns by vias, a plurality of coils including at least one each of the first and second coil patterns may be formed, and the plurality of coils may be connected in parallel to each other.

Claims

1. A coil component comprising:

a body including a plurality of first and second coil patterns which are alternately disposed and insulating layers disposed therebetween,

wherein each of the first coil patterns is connected to an adjacent one of the second coil patterns with one via,

a plurality of coils including at least one each of the first and second coil patterns are formed, and

the plurality of coils are electrically connected in parallel to each other.

2. The coil component of claim 1, wherein the plurality of first coil patterns are electrically connected in parallel to each other.

3. The coil component of claim 1, wherein the plurality of second coil patterns are electrically connected in parallel to each other.

4. The coil component of claim 1, wherein one of the vias electrically connects one of the first coil patterns to one of the second coil patterns adjacent to the first coil pattern, and the first coil pattern is not electrically connected to the other of the second coil patterns adjacent to the first coil pattern by the vias.

5. The coil component of claim 1, wherein the plurality of first coil patterns are electrically connected in series with the second coil patterns.

6. The coil component of claim 1, wherein the plurality of first and second coil patterns have a polygonal shape, a circular shape, an oval shape, or a track shape.

7. The coil component of claim 1, wherein the plurality of first and second coil patterns have a round shape.

8. The coil component of claim 1, wherein the number of vias is smaller than a sum of the numbers of the first and second coil patterns.

9. The coil component of claim 1, wherein the number of vias is half the sum of the numbers of the first and second coil patterns.

10. The coil component of claim 1, wherein the body includes a via connection pattern disposed between the first coil patterns and the second coil patterns.

11. The coil component of claim 10, wherein the via connection pattern is connected to the first and second coil patterns by the vias.

12. A method for manufacturing a coil component, the method comprising:

preparing a plurality of first insulator sheets in which first coil patterns and one via are formed;

preparing a plurality of second insulator sheets in which second coil patterns are formed; and

forming a body including a plurality of coils by alternately and collectively stacking the first and second insulator sheets,

wherein the first coil patterns are connected to the second coil patterns adjacent to the first coil patterns by vias,

a plurality of coils including at least one each of the first and second coil patterns are formed, and

the plurality of coils are connected in parallel to each other.

13. The method of claim 12, wherein the plurality of first coil patterns are connected in parallel to each other.

14. The method of claim 12, wherein the plurality of second coil patterns are connected in parallel to each other.

15. The method of claim 12, wherein one of the vias electrically connects one of the first coil patterns to one of the second coil patterns adjacent to the first coil pattern, and the first coil pattern is not electrically connected to the other of the second coil patterns adjacent to the first coil pattern by the vias.

16. The method of claim 14, wherein the number of vias is smaller than a sum of the numbers of the first and second coil patterns.