PCB MODULE WITH MULTI-SURFACE HEAT DISSIPATION STRUCTURE, HEAT DISSIPATION PLATE USED IN PCB MODULE, MULTI-LAYER PCB ASSEMBLY, AND MODULE CASE

• US 20180014426A1
• Filed: 11/22/2016
• Published: 01/11/2018
• Est. Priority Date: 07/05/2016
• Status: Abandoned Application

• Current Assignee: Ku Yong Kim
• Original Assignee: Ku Yong Kim
• Inventors: KIM, Ku Yong
• Application Number:
  US15/358,742
• Publication Number:
  US 20180014426A1
• Time in Patent Office: Days
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457
• CPC Class Codes: H05K 2201/041 Stacked PCBs, i.e. having neither an empty space nor mounted components in between
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09854 Hole or via having special cross-section, e.g. elliptical
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10242 Metallic cylinders small solder preforms other than balls H05K2203/0415
• CPC Class Codes: H05K 3/4608 comprising an electrically conductive base or core
• CPC Class Codes: H05K 5/0008 assembled by screws
• CPC Class Codes: H05K 7/20472 Sheet interfaces
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201

Abstract

A PCB module having a multi-surface heat dissipation structure is provided. The PCB module includes: a multi-layer PCB assembly which includes a heat dissipation plate having electrical insulating properties, and an upper PCB and a lower PCB attached to a top surface and a bottom surface of the heat dissipation plate, respectively; an upper case for covering a top surface of the multi-layer PCB assembly; and a lower case for covering a bottom surface of the multi-layer PCB assembly, and the heat dissipation plate includes; a first heat pole which is thermally in contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole which is thermally in contact with an inner surface of at least one of the upper and lower cases.

Claims

1. A PCB module having a multi-surface heat dissipation structure, the PCB module comprising:

a multi-layer PCB assembly which comprises a heat dissipation plate having electrical insulating properties, and an upper PCB and a lower PCB attached to a top surface and a bottom surface of the heat dissipation plate, respectively;

an upper case for covering a top surface of the multi-layer PCB assembly; and

a lower case for covering a bottom surface of the multi-layer PCB assembly,

wherein the heat dissipation plate comprises;

a first heat pole which is thermally in contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and

a second heat pole which is thermally in contact with an inner surface of at least one of the upper and lower cases.

2. The PCB module of claim 1, wherein a contact region is formed on the inner surface of at least one of the upper case and the lower case to be thermally in contact with the electronic circuit element mounted on the upper PCB or lower PCB.

3. The PCB module of claim 2, wherein the contact region comprises a thermal pad.

4. The PCB module of claim 1, wherein one or more penetrating regions are formed through the top and bottom surfaces of the heat dissipation plate, and

wherein the multi-layer PCB assembly comprises one or more contact points or contact regions where the upper PCB and the lower PCB are physically or electrically in contact with each other through the penetrating regions of the heat dissipation plate.

5. The PCB module of claim 1, wherein one or more penetrating portions are formed in at least one of the upper PCB and the lower PCB to allow the first heat pole or the second heat pole to be inserted therethrough, and

wherein the first heat pole protrudes to be flush with the surface of the upper PCB or the lower PCB, and the second heat pole protrudes to have a height to be in contact with the inner surface of the upper case or the lower case.

6. The PCB module of claim 5, further comprising an upper insulation layer having electrical insulating properties, which is interposed between the heat dissipation plate and the upper PCB;

and

a lower insulation layer having electrical insulating properties, which is interposed between the heat dissipation plate and the lower PCB.

7. The PCB module of claim 1, wherein an outer surface of at least one of the upper and lower cases has a first concavo-convex shape formed thereon, and

wherein the PCB module further comprises a heat dissipation structure which is attached to the outer surface of the at least one case and has a second concavo-convex shape to be engaged with the first concavo-convex shape.

8. A heat dissipation plate having electrical insulating properties, which is used in a multi-layer PCB assembly having a multi-surface heat dissipation structure, the heat dissipation plate comprising:

a first heat pole of a first height which protrudes from a top or bottom surface of the heat dissipation plate; and

a second heat pole of a second height which protrudes from the top or bottom surface of the heat dissipation plate,

wherein the heat dissipation plate is interposed between an upper PCB comprising a first layer circuit pattern of the multi-layer PCB assembly and a lower PCB comprising a second layer circuit pattern,

wherein the first heat pole is thermally in contact with an electronic circuit element mounted on the upper PCB or lower PCB, and

wherein the second heat pole is thermally in contact with an inner surface of a case for covering the top surface or bottom surface of the multi-layer PCB assembly.

9. The heat dissipation plate of claim 8, further comprising one or more penetration regions penetrating through the top and bottom surfaces of the heat dissipation plate, and

wherein the multi-layer PCB assembly comprises one or more contact points or contact regions where the upper PCB and the lower PCB are physically or electrically in contact with each other through the penetrating regions of the heat dissipation plate.

10. The heat dissipation plate of claim 8, wherein one or more penetrating portions are formed on at least one of the upper PCB and the lower PCB to allow the first heat pole or the second heat pole to be inserted therethrough, and

wherein the first height of the first heat pole is the same as height of the surface of the upper or lower PCB, and the second height of the second heat pole is high to be in contact with the inner surface of the case.

11. The heat dissipation plate of claim 10, wherein the first heat pole is configured to absorb heat generated from an electronic circuit element mounted on the upper or lower PCB, and the second heat pole is configured to discharge heat to the case.

12. A multi-layer PCB assembly which is used in a PCB module having a multi-surface heat dissipation structure, the multi-layer PCB assembly comprising:

an upper PCB which comprises a first layer circuit pattern of the multi-layer PCB assembly;

a lower PCB which comprises a second layer circuit pattern of the multi-layer PCB assembly; and

a heat dissipation plate having electrical insulating properties, which is interposed between the upper PCB and the lower PCB, and

wherein the heat dissipation plate comprises;

a first heat pole which is thermally in contact with an electronic circuit element mounted on the upper or lower PCB; and

a second heat pole which is thermally in contact with a surface of a case for covering the upper or lower PCB.

13. The multi-layer PCB assembly of claim 12, wherein one or more penetrating portions are formed on the upper or lower PCB to allow the first heat pole or the second heat pole to be inserted therethrough, and

wherein the first heat pole protrudes to be flush with the surface of the upper or lower PCB, and the second heat pole protrudes to have a height to be in contact with the inner surface of the case.

14. The multi-layer PCB assembly of claim 13, wherein the first heat pole is configured to absorb heat generated from an electronic circuit element mounted on the upper or lower PCB, and the second heat pole is configured to discharge heat to the case.

15. The multi-layer PCB assembly of claim 12, wherein one or more penetrating regions are formed through the top and bottom surfaces of the heat dissipation plate, and

wherein the multi-layer PCB assembly comprises one or more contact points or contact regions where the upper PCB and the lower PCB are physically or electrically in contact with each other through the penetrating regions of the heat dissipation plate.

16. The multi-layer PCB assembly of claim 12, further comprising:

an upper insulation layer having electrical insulating properties, which is interposed between the heat dissipation plate and the upper PCB; and

a lower insulation layer having electrical insulating properties, which is interposed between the heat dissipation plate and the lower PCB.