A METHOD AND APPARATUS FOR INTERCONNECTING PHOTONIC CIRCUITS

• US 20180017748A1
• Filed: 02/10/2015
• Published: 01/18/2018
• Est. Priority Date: 02/10/2015
• Status: Abandoned Application

• Current Assignee: Telefonaktiebolaget LM Ericsson
• Original Assignee: Telefonaktiebolaget LM Ericsson
• Inventors: MIR SHAFIEI, Mehrdad, BRUNNER, Robert, LESSARD, Stephane
• Application Number:
  US15/544,797
• Publication Number:
  US 20180017748A1
• Time in Patent Office: Days
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/122 Basic optical elements, e.g. light-guiding paths
• CPC Class Codes: G02B 6/13 Integrated optical circuits characterised by the manufacturing method
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Abstract

The teachings herein provide a method and apparatus for interconnecting photonic devices using an advantageous technique that forms an end-to-end optical path between photonic circuits using photonic wire bonds and a bridging glass member. The photonic wire bonds couple the photonic circuits to respective ends of an optical waveguide formed in the glass member. The end-to-end optical path thus comprises a “composite” optical waveguide that includes the photonic wire bonds and the optical wave-guide. Advantageously, these composite optical waveguides are formed in-place according to a process whereby the various components are placed into at least a rough alignment on a substrate and, after deposition of polymer photoresist, a femtosecond laser beam traces the end-to-end optical path, thereby forming the respective photonic wire bonds and optical waveguide in place.

Claims

1. A photonic device assembly comprising:

a substrate having a substrate surface;

first and second photonic circuits positioned on the substrate surface;

a glass body positioned on the substrate surface in proximity to the first and second photonic circuits; and

a first composite optical waveguide providing an end-to-end optical path between

the first photonic circuit and the second photonic circuit and comprising;

a first photonic wire bond formed from polymer photoresist via femtosecond-laser inscription and operative to optically couple the first photonic circuit to a first alignment point on the glass body;

a second photonic wire bond formed from polymer photoresist via femtosecond-laser inscription and operative to optically couple the second photonic circuit to a second alignment point on the glass body; and

an optical waveguide formed in the glass body via femtosecond-laser inscription and bridging between the first and second alignment points and thereby optically coupling the first photonic wire bond to the second photonic wire bond.

2. The photonic device assembly of claim 1, wherein the first and second photonic circuits are one circuit pair among of a plurality of circuit pairs carried on the substrate, and wherein each circuit pair is optically coupled together via a further composite optical waveguide constructed in like manner as said first composite optical waveguide.

3. The photonic device assembly of claim 1, further comprising a protective encapsulate or cladding at least covering the photonic wire bonds.

4. The photonic device assembly of claim 1, wherein the glass body is dimensioned so that the lengths of the first and second photonic wire bonds do not exceed a defined maximum length.

5. A method of fabricating a photonic device assembly that includes first and second photonic circuits positioned on a surface of a substrate, and further includes a glass body positioned on the surface of the substrate, said method implemented by a laser-inscribing apparatus and comprising:

obtaining a data set of three-dimensional coordinates that describes an end-to-end optical path optically coupling the first photonic circuit with the second photonic circuit, wherein the end-to-end optical path is to be formed as a composite optical waveguide that comprises;

a first photonic wire bond optically coupling the first photonic circuit to a first alignment point on the glass body;

a second photonic wire bond optically coupling the second photonic circuit to a second alignment point on the glass body; and

an optical waveguide formed in the glass body bridging between the first and second alignment points;

depositing polymer photoresist in fluid communication with the glass body and the first and second photonic circuits;

causing a femtosecond laser beam to trace a trajectory defined by the data set of three-dimensional coordinates and thereby forming the first and second photonic wire bonds and the optical waveguide; and

correspondingly operating the femtosecond laser beam according to one or more first control settings for forming the photonic wire bonds and according to one or more second control settings for forming the optical waveguide, to account for material properties of the polymer photoresist and material properties of the glass body.

6. The method of claim 5, wherein obtaining the data set of three-dimensional coordinates comprises:

obtaining alignment data for an interface point between the first photonic wire bond and the first photonic circuit, for an interface point between the first photonic wire bond and the glass body, for an interface point between the glass body and the second photonic wire bond, and for an interface point between the second photonic wire bond and the second photonic circuit; and

generating path data describing three-dimensional path trajectories interconnecting the interfaces.

7. The method of claim 6, wherein generating the path data comprises obtaining pre-calculated path data and modifying the pre-calculated path data to account for discrepancies between actual alignments detected between the first and second photonic circuits and the glass body as positioned on the surface of the substrate and nominal alignments assumed for the pre-calculated path data.

8. The method of claim 5, wherein the one or more first control settings comprise one or more first travel speed settings that are set in dependence on the material properties of the polymer photoresist, and wherein the one or more second control settings comprise one or more second travel speed settings that are set in dependence on the material properties of the glass body.

9. The method of claim 5, wherein the one or more first control settings comprise one or more first laser beam pulse-rate settings that are set in dependence on the material properties of the polymer photoresist, and wherein the one or more second control settings comprise one or more second laser beam pulse-rate settings that are set in dependence on the material properties of the glass body.

10. The method of claim 5, wherein the one or more first control settings comprise one or more first laser beam frequency and/or power settings that are set in dependence on the material properties of the polymer photoresist, and wherein the one or more second control settings comprise one or more second laser beam frequency and/or power settings that are set in dependence on the material properties of the glass body.

11. The method of claim 5, wherein operating the femtosecond laser beam according to the one or more first control settings for forming the photonic wire bonds and according to the one or more second control settings for forming the optical waveguide comprises controlling a laser apparatus having two separately selectable lasers, one having operating parameters set for polymer photoresist and one having operating parameters set for the glass body.

12. The method of claim 5, wherein operating the femtosecond laser beam according to the one or more first control settings for forming the photonic wire bonds and according to the one or more second control settings for forming the optical waveguide comprises controlling a laser apparatus having an adjustable laser beam and correspondingly operating the adjustable laser beam according to the one or more first control settings when inscribing the photonic wire bonds and operating the adjustable laser beam according to the one or more second control settings when inscribing the optical waveguide.

13. The method of claim 5, further comprising operating the femtosecond laser beam without an air gap with respect to the polymer photoresist, by immersing at least an emitting tip of a laser beam apparatus into the polymer photoresist for inscribing the photonic wire bonds.

14. The method of claim 5, further comprising operating the femtosecond laser beam without an air gap with respect to the polymer photoresist, by covering the polymer photoresist in an overlaying layer of fluid having an optical index similar to that of the polymer photoresist, and immersing at least an emitting tip of a laser beam apparatus into the overlaying layer of fluid for inscribing the photonic wire bonds.

15. The method of claim 5, wherein obtaining the data set of three-dimensional coordinates comprises computing the data set on fly from scan data acquired by scanning the substrate with the photonic circuits and glass body positioned thereon, or by retrieving the data set from an electronic data store in or accessible to the laser-inscribing apparatus, or by a combination of on-the-fly computation and data store retrieval.