COUPLING STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS

• US 20180017995A1
• Filed: 07/15/2016
• Published: 01/18/2018
• Est. Priority Date: 07/15/2016
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Gable, Brian M., Di Nallo, Carlo, Ely, Colin M., Horton, Craig A., de Jong, Erik G., Rothkopf, Fletcher R., Wettersten, Henry B., Li, Hoishun, Sauers, Jason C., Nath, Jayesh, Martinis, Mario, Pascolini, Mattia, Coleman, Michael P., Ehman, Rex T., Wang, Zheyu
• Granted Patent: US 10,372,166 B2
• Time in Patent Office: Days
• CPC Class Codes: B29C 70/763 the edges being disposed in a substantial flat plane
• CPC Class Codes: B29L 2031/3481 Housings or casings incorporating or embedding electric or electronic elements
• CPC Class Codes: G06F 1/163 Wearable computers, e.g. on a belt
• CPC Class Codes: G06F 1/1637 Details related to the display arrangement, including those related to the mounting of the display in the housing
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: H01Q 1/22 by structural association with other equipment or articles
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 21/28 Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00
• CPC Class Codes: H04B 1/3888 Arrangements for carrying or protecting transceivers
• CPC Class Codes: H04M 1/0202 Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03
• CPC Class Codes: H04M 1/0249 Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/18 Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment H04M1/19 takes precedence
• CPC Class Codes: H05K 5/0013 assembled by resilient members
• CPC Class Codes: H05K 5/04 Metal casings

Abstract

A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

Claims

1. A housing for an electronic device, comprising:

a first conductive component defining a first interface surface;

a second conductive component defining a second interface surface facing the first interface surface; and

a joint structure between the first and second interface surfaces, comprising;

a molded element forming a portion of an exterior surface of the housing; and

a sealing member abutting the molded element and forming a watertight seal between the first and second conductive components.

2. The housing of claim 1, wherein:

the sealing member and the molded element are electrical insulators; and

the sealing member and the molded element electrically isolate the first conductive component from the second conductive component.

3. The housing of claim 1, wherein:

the first and second conductive components comprise interlock features; and

the molded element engages the interlock features to retain the first conductive component to the second conductive component.

4. The housing of claim 1, wherein the sealing member comprises an elastomeric material.

5. The housing of claim 1, wherein the sealing member is compressed between the first and second interface surfaces.

6. The housing of claim 1, wherein:

the molded element is a first molded element; and

the sealing member is a second molded element.

7. The housing of claim 1, wherein the first conductive component, the second conductive component, and the molded element form a portion of the exterior surface of the housing.

8. A method of manufacturing a housing for an electronic device, comprising:

positioning a sealing member in a first portion of a gap between a first component and a second component, thereby forming a watertight seal between the first and second components; and

introducing a joining material into a second portion of the gap to form a molded element defining a portion of an exterior surface of the housing.

9. The method of claim 8, wherein:

the sealing member comprises a deformable material; and

the operation of positioning the sealing member in the first portion of the gap comprises;

compressing the deformable material in the first portion of the gap; and

applying a force to one or both of the first and second components.

10. The method of claim 9, further comprising:

prior to compressing the deformable material, positioning a shim in the gap; and

after introducing the joining material into the second portion of the gap, removing the shim from the gap.

11. The method of claim 9, wherein:

the operation of introducing the joining material into the second portion of the gap comprises flowing the joining material against interlock structures defined by the first and second components; and

the method further comprises;

hardening the joining material; and

removing the force after hardening the joining material;

wherein

after removing the force, the deformable material remains compressed between the first component and the second component.

12. The method of claim 8, wherein:

the first and second components are fixed to one another by a joining member that substantially maintains a size of the gap;

the sealing member comprises a deformable material;

the operation of positioning the sealing member in the first portion of the gap comprises forcing the sealing member into the gap, thereby compressing the deformable material; and

the method further comprises, after introducing the joining material into the second portion of the gap to form the molded element, removing the joining member.

13. The method of claim 8, wherein:

the operation of introducing the joining material into the second portion of the gap comprises;

flowing the joining material into the first and second portions of the gap;

curing the joining material to form a hardened joining material; and

removing at least part of the hardened joining material from the first portion of the gap, thereby forming the molded element; and

the operation of positioning the sealing member in the first portion of the gap occurs after the operation of introducing the joining material into the second portion of the gap.

14. The method of claim 8, wherein:

the operation of introducing the joining material into the second portion of the gap comprises;

positioning a spacer between the first and second components such that the spacer supports the first and second components in a spaced-apart configuration and occupies the first portion of the gap;

flowing the joining material into the second portion of the gap;

curing the joining material, thereby forming the molded element; and

removing the spacer from the gap to expose the first portion of the gap; and

the operation of positioning the sealing member in the first portion of the gap occurs after the operation of introducing the joining material into the second portion of the gap.

15-30. -30. (canceled)

31. An electronic device, comprising:

a display;

a cover over the display; and

a housing configured to receive the display and the cover, comprising;

a first component defining a top portion of the housing and receiving the cover thereon;

a second component defining a bottom portion of the housing and at least part of an interior cavity of the housing; and

a joint structure between the first and second components, comprising;

a molded element forming a portion of an exterior surface of the housing; and

an elastomeric sealing member abutting the molded element and between the first and second components.

32. The electronic device of claim 31, wherein:

the first and second components are formed of a conductive metal;

the elastomeric sealing member and the molded element are electrical insulators; and

the elastomeric sealing member and the molded element electrically isolate the first conductive component from the second conductive component.

33. The electronic device of claim 31, wherein:

the first and second components comprise interlock features; and

the molded element engages the interlock features to retain the first component to the second component.

34. The electronic device of claim 33, wherein the interlock features are dovetails.

35. The electronic device of claim 31, wherein the elastomeric sealing member is subject to a residual compressive force by the first and second components.

36. The electronic device of claim 31, wherein:

the first component defines an opening configured to receive the display and the cover therein; and

the elastomeric sealing member extends around a perimeter of the opening.

37. The electronic device of claim 31, wherein the first component, the second component, and the molded element form a portion of the exterior surface of the housing.

38. The electronic device of claim 31, wherein the molded element conforms to a shape of the elastomeric sealing member.