WIRING BODY, WIRING BOARD, AND TOUCH SENSOR

• US 20180018051A1
• Filed: 02/26/2016
• Published: 01/18/2018
• Est. Priority Date: 02/27/2015
• Status: Abandoned Application

• Current Assignee: Fujikura Limited
• Original Assignee: Fujikura Limited
• Inventors: Ogura, Shingo
• Application Number:
  US15/553,431
• Publication Number:
  US 20180018051A1
• Time in Patent Office: Days
• CPC Class Codes: G02F 1/13338 Input devices, e.g. touch panels
• CPC Class Codes: G02F 1/1343 Electrodes reflective electrodes G02F1/133553
• CPC Class Codes: G06F 2203/04112 Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/047 using sets of wires, e.g. crossed wires
• CPC Class Codes: H05K 1/02 Details

Abstract

A wiring body includes a first conductor layer, a second conductor layer, and a first insulation layer interposed between the first and second conductor layers. The first conductor layer includes a first electrode, a first lead wire electrically connected to the first electrode, and a first shield layer electrically insulated from the first electrode and the first lead wire. The second conductor layer includes a second electrode that faces the first electrode and a second lead wire electrically connected to the second electrode. The first electrode, the first lead wire, and the first shield layer are formed on substantially same plane. The second electrode and the second lead wire are formed on substantially same plane. A part of the second lead wire overlaps the first shield layer in a plan view. The first conductor layer includes a noncontact surface that is not in contact with the first insulation layer.

Claims

1. A wiring body comprising:

a first conductor layer;

a second conductor layer; and

a first insulation layer interposed between the first and second conductor layers, wherein

the first conductor layer includes;

a first electrode;

a first lead wire electrically connected to the first electrode; and

a first shield layer electrically insulated from the first electrode and the first lead wire,

the second conductor layer includes;

a second electrode that faces the first electrode; and

a second lead wire electrically connected to the second electrode,

the first electrode, the first lead wire, and the first shield layer are formed on substantially a same plane,

the second electrode and the second lead wire are formed on substantially a same plane,

at least a part of the second lead wire overlaps the first shield layer in a plan view,

the first conductor layer includes a noncontact surface that is not in contact with the first insulation layer,

the first conductor layer is embedded in the first insulation layer except the noncontact surface,

the second conductor layer is provided on the first insulation layer,

the first shield layer includes a conductor line,

the conductor line has a tapered shape that narrows toward a side approaching the second lead wire, and

the second lead wire has a tapered shape that narrows toward a side departing from the conductor line.

2. The wiring body according to claim 1, wherein

the second conductor layer further includes a second shield layer electrically insulated from the second electrode and the second lead wire and formed on substantially a same plane as the second electrode and the second lead wire, and

at least a part of the first lead wire overlaps the second shield layer in the plan view.

3. The wiring body according to claim 1, wherein at least one of the first and second shield layers is formed in a mesh-like shape.

4. The wiring body according to claim 3, wherein a surface roughness of the noncontact surface of the first conductor layer is rougher than a surface roughness of other surfaces than the noncontact surface of the first conductor layer.

5. The wiring body according to claim 4, a following Expression (1) is satisfied:

0.5≦

A . . .  

 

(1)

where A is a maximum value of C/B, B is a width of the first conductor layer in its cross-sectional view, and C is a height of the first conductor layer in its cross-sectional view.

6. The wiring body according to claim 1, further comprising a second insulation layer covering at least one of the first and second conductor layers.

7. A wiring board comprising:

the wiring body according to claim 1; and

a support body supporting the wiring body.

8. The wiring board according to claim 7, further comprising a third insulation layer interposed between the wiring body and the support body.

9. A touch sensor comprising the wiring board according to claim 7.