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INTERCONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

  • US 20180025975A1
  • Filed: 10/02/2017
  • Published: 01/25/2018
  • Est. Priority Date: 01/29/2016
  • Status: Active Grant
First Claim
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1. An interconnection structure, comprising:

  • a dielectric structure;

    an anti-adhesion layer; and

    a conductive structure, wherein a central portion of the conductive structure is surrounded by the anti-adhesion layer such that the central portion of the conductive structure is separated from a first portion of the dielectric structure by the anti-adhesion layer.

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