POWER CONVERSION DEVICE

• US 20180027704A1
• Filed: 03/25/2015
• Published: 01/25/2018
• Est. Priority Date: 03/25/2015
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: SHINOZAKI, Masaru, IPPOSHI, Shigetoshi, HIGASHINO, Hiroyuki, ASAI, YUGO, YANO, Hiroyuki, MATSUO, Haruyuki
• Granted Patent: US 10,383,262 B2
• Time in Patent Office: Days
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 5/03 Covers
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

The power conversion device of the invention includes: a cooling unit that is a prism, the interior of which is hollow, and that has a refrigerant inlet portion and a refrigerant outlet portion the cooling unit having in the interior thereof a refrigerant channel through which a refrigerant flows from the refrigerant inlet portion towards the refrigerant outlet portion; electronic devices that are respectively disposed on three or more surfaces on the outside of side surfaces of the cooling unit, excluding a refrigerant inlet surface, in which the refrigerant inlet portion is disposed, and a refrigerant outlet surface, in which the refrigerant outlet portion is disposed, the electronic devices being cooled by boiling of the refrigerant; and a hollow outer case 4 that covers the electronic devices.

Claims

1. A power-conversion device, comprising:

a cooling unit that is a prism, the interior of which is hollow, and that has a refrigerant inlet portion and a refrigerant outlet portion, the cooling unit having, in the interior thereof, a refrigerant channel through which a refrigerant flows from the refrigerant inlet portion towards the refrigerant outlet portion;

electronic devices that are respectively disposed on three or more surfaces on the outside of side surfaces of the cooling unit excluding a refrigerant inlet surface, in which the refrigerant inlet portion is disposed, and a refrigerant outlet surface, in which the refrigerant outlet portion is disposed, the electronic devices being cooled by boiling of the refrigerant; and

a hollow outer case that covers the electronic devices.

2. The power concession device of claim 1, wherein the electronic device of highest heat density or largest amount of heat from among the electronic devices is disposed on the outside of a bottom surface, from among the side surfaces of the cooling unit.

3. The power conversion device of claim 2, wherein plate thickness of the bottom surface, from among the side surfaces, is smaller than that of other side surfaces of the cooling unit.

4. The power conversion device of claim 2, wherein the electronic device of lowest heat density from among the electronic devices is disposed on the outside of a top surface, from among the side surfaces of the cooling unit.

5. The power conversion device of claim 1, wherein one surface of the side surfaces of the cooling unit excluding the refrigerant inlet surface and the refrigerant outlet surface, is configured in the form of a plate-like lid part, such that the cooling unit excluding the lid part, is formed as a body separate from the lid part, with the cooling unit being formed by joining the lid part to the cooling unit excluding the lid part.

6. The power conversion device of claim 1, wherein a fin is provided on the inner side of the top surface, among the side surfaces of the cooling unit.

7. The power conversion device of claim 1, wherein

the refrigerant inlet portion and the refrigerant outlet portion are provided on one same surface of the cooling unit, and the cooling unit has a partition that splits the refrigerant channel into a first region that is in contact with the refrigerant inlet portion and into a second region that is in contact with the refrigerant outlet portion;

and the partition forms a gap, through which the refrigerant flows, between the partition and the surface of the cooling unit opposing the same surface.

8. The power conversion device of claim 3, wherein the electronic device of lowest density from among the electronic devices is disposed on the outside of a top surface, from among the side surfaces of the cooling unit.

9. The power conversion device of claim 1,

wherein from among the electronic devices, the electronic device disposed on the outside of a bottom surface, from among the side surfaces of she cooling unit, is power module.

10. The power conversion device of claim 1,

wherein from among the electronic devices, the electronic device disposed on the outside of the side surface is a control circuit or a driving circuit.

11. The power conversion device of claim 1,

wherein from among the electronic devices, the electronic device that is disposed on the outside of the side surface is a capacitor or a step-down converter.