TEST BOARD FOR SEMICONDUCTOR PACKAGE, TEST SYSTEM, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

• US 20180031629A1
• Filed: 03/10/2017
• Published: 02/01/2018
• Est. Priority Date: 07/27/2016
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: YUN, Joo-sung, CHOI, Woon-sup, LEE, Moon-ho, SHIN, Seong-seob
• Granted Patent: US 10,088,521 B2
• Time in Patent Office: Days
• CPC Class Codes: G01R 1/0433 Sockets for IC's or transistors
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

Abstract

A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.

Claims

1. A test board comprising:

a board substrate;

a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package;

a test controller;

a wireless signal unit configured to wirelessly exchange signals with a server; and

a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket,

wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.

2. The test board of claim 1, wherein the test controller is attached to a first surface of the board substrate.

3. The test board of claim 1, wherein the wireless signal unit comprises a wireless signal transceiver that is attached to a first surface of the board substrate, and

wherein the wireless power unit comprises:

a power receiver attached to a second surface opposite to the first surface of the board substrate; and

a power storage and supply unit configure to store and to supply the electric power received by the power receiver from the external source.

8. The test board of claim 1, wherein the test controller comprises:

a hardware processor;

a transceiver configured to communicate with the semiconductor package to be tested; and

an algorithmic pattern generator configured to convert the test pattern command to a signal to be applied to the semiconductor package.

4-7. -7. (canceled)

9. A test system comprising:

a server; and

a plurality of test boards configured to wirelessly exchange signals with the server,

wherein each of the plurality of test boards comprises;

a device under test (DUT) socket configured to accommodate a semiconductor package;

a test controller configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server; and

a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket.

10. The test system of claim 9, wherein each of the plurality of test boards is configured to independently and simultaneously perform the test on the semiconductor package accommodated in the DUT socket.

11. The test system of claim 9, wherein the wireless power unit comprises:

a power receiver; and

a power storage and supply unit configured to store and to supply the electric power that the power receiver wirelessly received from the external source.

12. The test system of claim 11, wherein the external source comprises a power supply unit configured to wirelessly supply the electric power to the wireless power unit of each of the plurality of test boards.

13. The test system of claim 12, wherein the power supply unit is configured to wirelessly supply the electric power to the wireless power unit of each of the plurality of test boards while each of the plurality of test boards performs a test.

14. The test system of claim 12, wherein, before the semiconductor package is accommodated in the DUT socket of each of the plurality of test boards, the power supply unit is configured to wirelessly supply the electric power to the wireless power unit of each of the plurality of test boards to charge the power storage and supply unit.

15. The test system of claim 12, further comprising a wireless signal unit configured to wirelessly exchange signals with the server,

wherein the wireless signal unit comprises a wireless signal transceiver attached to a first surface of a board substrate of the test board, and

wherein the power receiver is attached to a second surface opposite to the first surface of the board substrate.

17. The test system of claim 15, wherein the power storage and supply unit comprises a secondary battery, and

wherein the secondary battery of the power storage and supply unit is attached to the second surface of the board substrate.

18. The test system of claim 15, wherein the power storage and supply unit comprises a secondary battery, and

wherein the secondary battery of the power storage and supply unit is attached to the first surface of the board substrate.

19. The test system of claim 9, further comprising a device attachment/detachment apparatus configured to attach or detach the semiconductor package to be tested to or from the DUT socket of each of the plurality of test boards.

21. The test system of claim 9 further comprises a connector attached to a side surface of a board substrate of the test board,

wherein the DUT socket is connected to the connector.

22. The test system of claim 9, wherein each of the plurality of test boards further comprises a memory configured to store the test pattern command being wirelessly received from the server and a result of the test performed by the test controller.

16. (canceled)

20. (canceled)

23. (canceled)

24. A method of manufacturing a semiconductor package, the method comprising:

manufacturing a plurality of semiconductor packages; and

performing a test on each of the plurality of semiconductor packages,

wherein the performing the test comprises;

preparing a plurality of test boards, each of the plurality of test boards comprising;

a device under test (DUT) socket;

a test controller;

a wireless signal unit; and

a wireless power unit that is wirelessly charged, that supplies electric power to the test controller and the DUT socket, and that includes a secondary battery;

accommodating the plurality of semiconductor packages in the DUT sockets of the plurality of test boards; and

independently performing the test on each semiconductor package accommodated in the DUT socket, in response to a test pattern command being wirelessly received from a server via the wireless signal unit.

25. The method of claim 24, wherein, in the performing the test, a test is independently and simultaneously performed on a semiconductor package accommodated in the DUT socket of each of the plurality of test boards.

26. The method of claim 24, further comprising wirelessly supplying electric power to the wireless power unit to charge the secondary battery of each of the plurality of test boards.

27. The method of claim 26, wherein, in the wirelessly supplying the electric power, the secondary battery is charged before the plurality of semiconductor packages are accommodated in the DUT sockets.

28. The method of claim 26, wherein, in the wirelessly supplying the electric power, the secondary battery is charged in the middle of performing the test.

29. A test system comprising:

a test board comprising;

a board substrate;

a wireless signal transceiver and a power storage and supply unit provided on a first side of the board substrate; and

a power receiver provided on a second side opposite of the first side of the board substrate; and

a power supply unit configured to charge the power storage and supply unit provided on the test board and comprising;

a power generator; and

a power transmitter,

wherein the test board is provided on the power transmitter.

30. The test system of claim 29, wherein the power transmitter comprises:

a first power transmitter; and

a second power transmitter,

wherein the test board comprises;

a first test board; and

a second test board,

wherein the first test board is provided on the first power transmitter and the second test board is provided on the second power transmitter, and

wherein the first power transmitter is stacked on the second power transmitter with an interval therebetween.

31. The test system of claim 30, wherein the interval between the first and second power transmitters is greater than a thickness of the test board.

32. The test system of claim 29, wherein the power supply unit is configured to wirelessly charge the power storage and supply unit.