METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL

• US 20180033551A1
• Filed: 10/06/2017
• Published: 02/01/2018
• Est. Priority Date: 03/14/2013
• Status: Active Grant

• Current Assignee: Sumida Corporation
• Original Assignee: Sumida Corporation
• Inventors: SAKAMOTO, Shinichi, MALCOLM, Douglas James
• Granted Patent: US 10,304,624 B2
• Time in Patent Office: Days
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/022 Encapsulation
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 27/2828 Construction of conductive connections, of leads
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01F 41/02 for manufacturing cores, coils, or magnets H01F41/14 takes precedence; for dynamo-electric machines H02K15/00
• CPC Class Codes: H01F 41/0246 Manufacturing of magnetic circuits by moulding or by pressing powder magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36
• CPC Class Codes: H01F 41/064 Winding non-flat conductive wires, e.g. rods, cables or cords
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 by winding or coiling

Abstract

A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm² to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.

Claims

1. A method for manufacturing an electronic component comprising:

placing a T-shaped core and an air-core coil in a mold;

embedding the T-shaped core and the air-core coil in a mixture of a metal magnetic material and a thermosetting resin by applying pressure to the mixture in the mold so that a shape of the mixture conforms to the T-shaped core, the air-core coil, and the mold; and

after embedding, heating the mixture at a predetermined temperature for a predetermined time so that the mixture is hardened.

2. The method for manufacturing an electronic component according to claim 1,

wherein the predetermined temperature is in a range of 120 to 200°

C. and the predetermined time is in a range of 10 to 90 minutes, and

the mixture is changed from a not fully hardened state to a solid state by the heating.

3. The method for manufacturing an electronic component according to claim 1,

wherein the pressure is in a range of 0.1 to 20.0 kg/cm².

4. The method for manufacturing an electronic component according to claim 1,

wherein the predetermined temperature is in a range of 120 to 200°

C. and the predetermined time is in a range of 10 to 90 minutes, and

the pressure is in a range of 0.1 to 20.0 kg/cm².

5. The method for manufacturing an electronic component according to claim 1, further comprising:

winding a wire to form the air-core coil,

wherein both ends of the wire are flat.

6. The method for manufacturing an electronic component according to claim 1, further comprising:

winding a flat rectangular wire to form the air-core coil,

wherein an inside diameter of the air-core coil is larger than an outside diameter of a core of the T-shaped core.

7. The method for manufacturing an electronic component according to claim 1, further comprising:

applying solder at both ends of end wires of the air-core coil;

placing the air-core coil on a first surface of the T-shaped core;

bending the end wires at a side of the T-shaped core; and

fixing both ends to a second surface of the T-shaped core opposite the first surface.

8. A method for manufacturing an electronic component comprising:

placing an air-core coil wrapped core in a mold;

embedding the air-core wrapped core in a mixture of a metal magnetic material and a thermosetting resin by applying pressure to the mixture in the mold so that a shape of the mixture conforms to the air-core wrapped core and the mold; and

after embedding, heating the mixture at a predetermined temperature for a predetermined time so that the mixture is hardened.

9. The method for manufacturing an electronic component according to claim 8,

wherein the predetermined temperature is in a range of 120 to 200°

C. and the predetermined time is in a range of 10 to 90 minutes, and

the mixture is changed from a not fully hardened state to a solid state by the heating.

10. The method for manufacturing an electronic component according to claim 8,

wherein the pressure is in a range of 0.1 to 20.0 kg/cm².

11. The method for manufacturing an electronic component according to claim 8,

wherein the predetermined temperature is in a range of 120 to 200°

C. and the predetermined time is in a range of 10 to 90 minutes, and

the pressure is in a range of 0.1 to 20.0 kg/cm².

12. The method for manufacturing an electronic component according to claim 8, further comprising:

winding a wire to form the air-core coil,

wherein both ends of the wire are flat.

13. The method for manufacturing an electronic component according to claim 8, further comprising:

winding a flat rectangular wire to form the air-core coil,

wherein an inside diameter of the air-core coil is larger than an outside diameter of the core.

14. The method for manufacturing an electronic component according to claim 8, further comprising:

applying solder at both ends of end wires of the air-core coil;

placing the air-core coil on a first surface of the core;

bending the end wires at a side of the core; and

fixing both ends to a second surface of the core opposite the first surface.

15. A method for manufacturing an electronic component comprising:

manufacturing a T-shaped core;

manufacturing an air-core coil;

assembling the air-core coil onto the T-shaped core;

placing the T-shaped core and the air-core coil assembly in a mold;

embedding the T-shaped core and the air-core coil assembly in a mixture of a metal magnetic material and a thermosetting resin by applying pressure to the mixture in the mold so that a shape of the mixture conforms to the air-core coil, the T-shaped core, and the mold; and

after embedding, heating the mixture at a predetermined temperature for a predetermined time so that the mixture is hardened,

wherein the assembling the air-core coil onto the T-shaped core includes;

placing the air-core coil on a first surface of the T-shaped core;

bending end wires of the air-core coil at a side of the T-shaped core; and

fixing both ends of the end wires to a second surface of the T-shaped core, the second surface being opposite to the first surface.

16. The method for manufacturing an electronic component according to claim 15,

wherein the predetermined temperature is in a range of 120 to 200°

C. and the predetermined time is in a range of 10 to 90 minutes, and

the mixture is changed from a not fully hardened state to a solid state by the heating.

17. The method for manufacturing an electronic component according to claim 15,

wherein the pressure is in a range of 0.1 to 20.0 kg/cm².

18. The method for manufacturing an electronic component according to claim 15,

wherein the predetermined temperature is in a range of 120 to 200°

C. and the predetermined time is in a range of 10 to 90 minutes, and

the pressure is in a range of 0.1 to 20.0 kg/cm².

19. The method for manufacturing an electronic component according to claim 15, further comprising:

winding a wire to form the air-core coil; and

applying solder at both ends of end wires of the air-core coil,

wherein both ends of the wire are flat.

20. The method for manufacturing an electronic component according to claim 15, further comprising:

winding a flat rectangular wire to form the air-core coil,

wherein an inside diameter of the air-core coil is larger than an outside diameter of a core of the T-shaped core.

21. A method for manufacturing an electronic component comprising:

manufacturing a T-shaped core;

manufacturing an air-core coil;

assembling the air-core coil onto the T-shaped core;

placing the T-shaped core and the air-core coil assembly in a mold; and

embedding the T-shaped core and the air-core coil assembly in a mixture of a metal magnetic material and a thermosetting resin by applying pressure to the mixture in the mold so that a shape of the mixture conforms to the air-core coil, the T-shaped core, and the mold; and

after embedding, heating the mixture at a predetermined temperature for a predetermined time so that the mixture is hardened,

wherein the assembling the air-core coil onto the T-shaped core includes;

placing the air-core coil on a first surface of the T-shaped core;

bending end wires of the air-core coil at a first side of the T-shaped core;

extending the end wires of the air-core coil across a second surface of the T-shaped core, the second surface being opposite to the first surface; and

bending the end wires at a second side of the T-shaped core, the second side being opposite to the first side.

22. The method for manufacturing an electronic component according to claim 21,

wherein the assembling the air-core coil with the T-shaped core includes applying solder at both ends of the end wires of the air-core coil.

23. The method for manufacturing an electronic component according to claim 21, further comprising:

winding a flat rectangular wire to form the air-core coil,

wherein an inside diameter of the air-core coil is larger than an outside diameter of a core of the T-shaped core.

24. The method for manufacturing an electronic component according to claim 21,

wherein the predetermined temperature is in a range of 120 to 200°

C. and the predetermined time is in a range of 10 to 90 minutes, and

the mixture is changed from a not fully hardened state to a solid state by the heating.

25. The method for manufacturing an electronic component according to claim 21,

wherein the pressure is in a range of 0.1 to 20.0 kg/cm².

26. The method for manufacturing an electronic component according to claim 21,

wherein the predetermined temperature is in a range of 120 to 200°

C. and the predetermined time is in a range of 10 to 90 minutes, and

the pressure is in a range of 0.1 to 20.0 kg/cm².