MEMS SWITCH

• US 20180033565A1
• Filed: 07/28/2017
• Published: 02/01/2018
• Est. Priority Date: 04/25/2014
• Status: Abandoned Application

• Current Assignee: Analog Devices International Unlimited Company (Analog Devices, Inc.)
• Original Assignee: Analog Devices Global Unlimited Company (Analog Devices, Inc.)
• Inventors: Fitzgerald, Padraig, Wong, Jo-ey, Goggin, Raymond C., Stenson, Bernard Patrick, Lambkin, Paul, Schirmer, Mark
• Application Number:
  US15/663,628
• Publication Number:
  US 20180033565A1
• Time in Patent Office: Days
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 2001/0084 with perpendicular movement of the movable contact relative to the substrate
• CPC Class Codes: H01H 2059/0018 Special provisions for avoiding charge trapping, e.g. insulation layer between actuating electrodes being permanently polarised by charge trapping so that actuating or release voltage is altered
• CPC Class Codes: H01H 2059/0072 with stoppers or protrusions for maintaining a gap, reducing the contact area or for preventing stiction between the movable and the fixed electrode in the attracted position
• CPC Class Codes: H01H 59/0009 making use of micromechanics

Abstract

Several features are disclosed that improve the operating performance of MEMS switches such that they exhibit improved in-service life and better control over switching on and off.

Claims

1. A MEMS component, comprising:

a substrate;

a support;

a movable structure connected to the support and extending in a first direction and having a free end delimited by an edge and having a contact carrier extending therefrom;

a control electrode;

wherein;

the support extends from the substrate and holds a portion of the movable structure adjacent the substrate;

the movable structure overlaps with the control electrode;

the control electrode extends past the edge of the movable structure in the first direction except in a region of a contact carrier portion of the movable structure;

a spatial extent of the control electrode in a second direction is greater than the spatial extent of the movable structure in the second direction, and the control electrode is configured to shield the movable structure from charge that gets trapped in the substrate such that the movable structure returns without delay to a rest position when a control voltage which has been applied for more than a day is removed.

2. A MEMS component as claimed in claim 1 in which the movable structure returns without delay to the rest position when the control voltage is removed after being applied for several months.

3. A MEMS component as claimed in claim 1, wherein the second direction is perpendicular to the first direction such that the control electrode extends beyond opposing sides of the movable structure in the second direction.

4. A MEMS component as claimed in claim 1, in which a second portion of the movable structure extends in a third direction from the support, the third direction being substantially opposed to the first direction, and where the second portion overlaps with a second control electrode.

5. A MEMS component as claimed in claim 1, wherein the movable structure includes a depending bumper or support arranged not to touch the control electrode.

6. A MEMS component as claimed in claim 5, in which the depending bumper or support is positioned to one side of the control electrode.

7. A MEMS component as claimed in claim 5, in which the depending bumper or support is positioned on the movable structure in a region overlapping the control electrode, and the control electrode includes an aperture in a corresponding portion of the control electrode.

8. A MEMS component as claimed in claim 1, further comprising an insulator between the control electrode and the movable structure.

9. A MEMS component as claimed in claim 1 in which the movable structure tapers monotonically towards the contact carrier.

10. A MEMS component as claimed in claim 1, wherein:

the substrate has a first coefficient of thermal expansion;

the support has a second coefficient of thermal expansion;

the MEMS component further comprising an expansion modification structure at or adjacent an interface between the substrate and the support, and having a third coefficient of expansion greater than the first coefficient of expansion, and arranged to exert a thermal expansion force on the substrate in the vicinity of the interface so as to simulate a fourth coefficient of expansion different from the first coefficient in the substrate in the vicinity of the interface.

11. A MEMS component as claimed in claim 10, in which the third coefficient of thermal expansion is greater than the second coefficient of thermal expansion.

12. A MEMS component as claimed in claim 10, in which the expansion modification structure comprises a plate or block structure buried beneath a foot of the support.

13. A MEMS component as claimed in claim 10, in which the expansion modification structure is separated from the support by a portion of the substrate.

14. A MEMS component as claimed in claim 10, in which the expansion modification structure extends beyond an edge of the support.

15. A MEMS component as claimed in claim 10, in which the expansion modification structure is formed of Aluminum or Copper.

16. A MEMS component as claimed in claim 1, in which the MEMS component is a switch and the movable structure is a switch member supported by the support.

17. A MEMS component as claimed in claim 1, in which the support has at least one slot formed therein to divide the support into a plurality of upstanding elements.

18. A MEMS component as claimed in claim 17, in which the at least one slot extends through the support dividing it into a plurality of pillars and in which the movable structure is slotted along a portion of its length.

19. A MEMS component as claimed in claim 3, in which the second control electrode is connected to the first control electrode via an electrostatic protection or overvoltage protection device.

20. A MEMS component as claimed in claim 3, in which the second control electrode is connected to the first control electrode by a high impedance path such that a voltage at the second control electrode lags a voltage of the first control electrode.

21. A MEMS switch as claimed in claim 3, in which a voltage at the second control electrode tends to a fraction of a voltage at the first control electrode as set by a potential divider.

22. A MEMS component, comprising:

a substrate;

a support;

a movable structure connected to the support and extending in a first direction and having a free end delimited by an edge control electrode;

wherein;

the support extends from the substrate and holds a portion of the movable structure adjacent the substrate;

the movable structure overlaps with the control electrode;

the control electrode extends past the edge of the movable structure in the first direction;

a spatial extent of the control electrode in a second direction perpendicular to the first direction is greater than the spatial extent of the movable structure in the second direction, and wherein a depending contact if formed on the movable structure between the support and the free end, and the depending contact aligns with a drain or source contact that is formed within, but separated from, the control electrode.

23. A MEMS component, comprising:

a substrate;

a support;

a movable structure connected to the support and extending in a first direction and having a free end delimited by an edge and having a contact carrier extending therefrom;

a control electrode;

wherein;

the support extends from the substrate and holds a portion of the movable structure adjacent the substrate;

the movable structure overlaps with the control electrode;

the control electrode extends past the edge of the movable structure in the first direction except in a region of a contact carrier portion of the movable structure;

a spatial extent of the control electrode in a second direction is greater than the spatial extent of the movable structure in the second direction, and the control electrode is configured to shield the movable structure from charge that gets trapped in the substrate such that the movable structure returns when a control voltage is removed and, wherein;

the substrate has a first coefficient of thermal expansion;

the support has a second coefficient of thermal expansion;

the MEMS component further comprising an expansion modification structure at or adjacent an interface between the substrate and the support, and having a third coefficient of expansion greater than the first coefficient of expansion, and arranged to exert a thermal expansion force on the substrate in the vicinity of the interface so as to simulate a fourth coefficient of expansion different from the first coefficient in the substrate in the vicinity of the interface.