SUBSTRATE TREATING SYSTEM

• US 20180033661A1
• Filed: 07/20/2017
• Published: 02/01/2018
• Est. Priority Date: 07/29/2016
• Status: Active Grant

• Current Assignee: Semes Co., Ltd (Samsung Electronics Co. Ltd.)
• Original Assignee: Semes Co., Ltd (Samsung Electronics Co. Ltd.)
• Inventors: LEE, JUNGHWAN, OH, RAETAEK
• Granted Patent: US 10,446,425 B2
• Time in Patent Office: Days
• CPC Class Codes: B65G 49/07 for semiconductor wafers Not used, see H01L21/677specially adapted for conveying of semiconductor wafers during manufacture or treatment of semiconductor or electric solid state devices or components H01L21/677
• CPC Class Codes: H01L 21/67184 characterized by the presence of more than one transfer chamber
• CPC Class Codes: H01L 21/67309 characterized by the substrate support
• CPC Class Codes: H01L 21/67766 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers
• CPC Class Codes: H01L 21/67781 Batch transfer of wafers
• CPC Class Codes: H01L 21/68707 the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

Disclosed is a substrate treating system. The substrate treating system includes an index unit having a port, on which a container containing a substrate is positioned, and an index robot, a process executing unit having substrate treating apparatuses for treating the substrate and a main transferring robot for transferring the substrate, and a buffer unit disposed between the process executing unit and the index unit and in which the substrate fed between the process executing unit and the index unit temporarily stays. Each of the index robot, the substrate treating apparatuses, the main transferring robot, and the buffer unit includes a conductive part contacting the substrate to remove static electricity of the substrate.

Claims

1. A substrate treating system comprising:

an index unit having a port, on which a container containing a substrate is positioned, and an index robot;

a process executing unit having substrate treating apparatuses for treating the substrate and a main transferring robot for transferring the substrate; and

a buffer unit disposed between the process executing unit and the index unit and in which the substrate transferred between the process executing unit and the index unit temporarily stays,

wherein each of the index robot, the substrate treating apparatuses, the main transferring robot, and the buffer unit includes a conductive part contacting the substrate to remove static electricity of the substrate.

2. The substrate treating system of claim 1, wherein the conductive parts of the index robot, the substrate treating apparatuses, the main transferring robot, and the buffer unit are formed of electrically conductive materials having different resistances.

3. The substrate treating system of claim 1, wherein the resistances of the conductive parts of the index robot, the substrate treating apparatuses, the main transferring robot, and the buffer unit become lower such that static electricity removal capacities of the index robot, the substrate treating apparatuses, the main transferring robot, and the buffer unit sequentially increase.

4. The substrate treating system of claim 1, wherein each of the substrate treating apparatuses has a substrate support member in which the substrate is seated,

wherein the substrate support member has a first conductive part contacting with the substrate, and the first conductive part is formed of an electrically conductive material having a resistance of 10̂

6Ω

/sq,

wherein the main transferring robot has a first blade in which the substrate is seated, the first blade has a second conductive part contacting the substrate, and the second conductive part is formed of an electrically conductive material having a resistance of 10̂

5Ω

/sq,

wherein the buffer unit has a slot in which the substrate is seated, the slot has a third conductive part contacting the substrate, and the third conductive part is formed of an electrically conductive material having a resistance of 10̂

4Ω

/sq, and

wherein the index robot has a second blade in which the substrate is seated, the second blade has a fourth conductive part contacting the substrate, and the fourth conductive part is formed of an electrically conductive material having a resistance of 10̂

3Ω

/sq.