ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME

• US 20180033952A1
• Filed: 07/11/2017
• Published: 02/01/2018
• Est. Priority Date: 07/28/2016
• Status: Active Grant

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: YAMAMOTO, Shinji, KONNO, Jumpei, MIYAGAWA, Takashi
• Granted Patent: US 10,199,562 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 2224/81192 wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H03H 3/02 for the manufacture of piezoelectric or electrostrictive resonators or networks H03H3/08 takes precedence
• CPC Class Codes: H03H 3/08 for the manufacture of resonators or networks using surface acoustic waves
• CPC Class Codes: H03H 9/0523 for flip-chip mounting
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/14541 Multilayer finger or busbar electrode
• CPC Class Codes: H03H 9/25 Constructional features of resonators using surface acoustic waves devices for manipulating acoustic surface waves in general G10K11/36
• CPC Class Codes: H10N 30/02 Forming enclosures or casings
• CPC Class Codes: H10N 30/06 Forming electrodes or interconnections, e.g. leads or terminals
• CPC Class Codes: H10N 30/072 by laminating or bonding of piezoelectric or electrostrictive bodies
• CPC Class Codes: H10N 30/8542 Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
• CPC Class Codes: H10N 30/875 Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
• CPC Class Codes: H10N 30/883 Further insulation means against electrical, physical or chemical damage, e.g. protective coatings

Abstract

A method of fabricating an electronic device, the method including: arranging a device chip with no bump located on a lower surface of the device chip on a mounting substrate including a bump located on an upper surface of the mounting substrate; and bonding a pad located on the lower surface of the device chip and the bump by applying an ultrasonic wave to the device chip from an upper surface of the device chip.

Claims

1. A method of fabricating an electronic device, the method comprising:

arranging a device chip with no bump located on a lower surface of the device chip on a mounting substrate including a bump located on an upper surface of the mounting substrate; and

bonding a pad located on the lower surface of the device chip and the bump by applying an ultrasonic wave to the device chip from an upper surface of the device chip.

2. The method according to claim 1, wherein

the pad and the bump are made of a same material.

3. The method according to claim 1, wherein

an area of a bond between the bump and the mounting substrate is greater than an area of a bond between the pad and the bump.

4. The method according to claim 2, wherein the bump is a gold bump.

5. The method according to claim 1, wherein the device chip includes a functional element and a frame body surrounding the functional element and having a larger thickness than the functional element on the lower surface of the device chip.

6. The method according to claim 5, wherein the frame body is a burr formed when the device chip is cut by a dicing blade.

7. The method according to claim 5, further comprising:

causing a tool to hold the device chip by causing the tool to be in contact with a lower surface of the frame body without being contact with a lower surface of the functional element.

9. The method according to claim 5, wherein the functional element is an acoustic wave element.

8. A method of fabricating an electronic device, the method comprising:

forming a functional element on an upper surface of a substrate;

forming a metal layer on the upper surface of the substrate so that the metal layer surrounds the functional element;

forming a burr on an upper surface of the metal layer and cutting the substrate into a plurality of device chips by dicing the metal layer and the substrate with use of a dicing blade; and

causing a tool to hold at least one of the plurality of device chips by causing the tool to be in contact with an upper surface of the burr without being in contact with an upper surface of the functional element.

10. The method according to claim 8, wherein the functional element is an acoustic wave element.

11. An electronic device comprising:

a mounting substrate;

a device chip including a functional element and a pad on a lower surface of the device chip, the functional element facing an upper surface of the mounting substrate across an air gap; and

a single bump bonding the mounting substrate and the pad, an area of a bond between the single bump and the pad being less than an area of a bond between the single bump and the mounting substrate.