ANTENNAS IN ELECTRONIC DEVICES

• US 20180034134A1
• Filed: 08/01/2016
• Published: 02/01/2018
• Est. Priority Date: 08/01/2016
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel IP Corporation (Intel Corporation)
• Inventors: Dalmia, Sidharth
• Granted Patent: US 10,186,756 B2
• Time in Patent Office: Days
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 19/30 the primary active element being centre-fed and substantially straight, e.g. Yagi antenna
• CPC Class Codes: H01Q 21/28 Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00
• CPC Class Codes: H01Q 21/29 Combinations of different interacting antenna units for giving a desired directional characteristic H01Q25/00 takes precedence
• CPC Class Codes: H01Q 5/49 with parasitic elements used for purposes other than for dual-band or multi-band, e.g. imbricated Yagi antennas

Abstract

In various embodiments, the disclosure describes systems and methods that can be use in connection with electronic devices (for example, mobile devices) and can include one or more a dies, first antenna elements/feeding elements electrically coupled to the die, and second antenna elements/parasitic elements disposed on at least a portion of the electronic device. In one embodiment, the parasitic elements can be disposed near the feeding element and in a spaced relationship over one or more gaps. Further the parasitic elements can be electrically coupled to the feeding element over the gap. In various embodiments, the disclosed systems and methods can be used to implement a Yagi-Uda antenna in an electronic device, for example, a mobile device.

Claims

1. An electronic device comprising:

a substrate including a die and an antenna feeding element having a wired connection to the die; and

a chassis component comprising an antenna parasitic element, the chassis component disposed substantially proximate to the substrate to align the antenna parasitic element in a spaced relationship with the antenna feeding element, the antenna feeding element and the antenna parasitic element at least partially define a gap therebetween.

2. The electronic device of claim 1, wherein the antenna feeding element is integral to the die.

3. The electronic device of claim 1, further comprising an alignment element, wherein the antenna feeding element and the antenna parasitic element are positioned relative to one another using the alignment element.

4. The electronic device of claim 1, wherein the antenna feeding element and the antenna parasitic element form at least a portion of a Yagi-Uda antenna.

5. The electronic device of claim 1 wherein the antenna feeding element and the antenna parasitic element form at least a portion of a millimeter wave antenna.

6. The electronic device of claim 1, wherein the chassis component comprises a cover associated with the electronic device.

7. The electronic device of claim 1, wherein the chassis component further comprises one or more of an adhesive film or an epoxy, whereby the antenna parasitic element is mechanically coupled to the chassis component by the one or more of the adhesive film or the epoxy.

8. The electronic device of claim 1, wherein the gap is filled with one or more of a gas, a gap element, a liquid, or a dielectric material.

9. The electronic device of claim 1, wherein the antenna feeding element or the antenna parasitic element comprises one or more of a patch antenna, a spiral antenna, a monopole antenna, a dipole antenna, a planar inverted f antenna (PIFA), or a fractal antenna.

10. The electronic device of claim 1, further comprising a reflector that directs radiation emitted by the antenna feeding element or antenna parasitic element.

11. The electronic device of claim 1, wherein at least a portion of the antenna parasitic element is integrated in the chassis component.

12. The electronic device of claim 1 wherein at least a portion of the antenna feeding element or the antenna parasitic element comprises a high dielectric constant material.

13. A mobile electronic device comprising:

a display device; and

a housing member coupled to the display device, the housing member comprising,

circuitry comprising computing components and storage components, a portion of the circuitry coupled to the display device;

a substrate including a die and an antenna feeding element, the antenna feeding element having a wired connection to the die; and

a chassis component comprising an antenna parasitic element, the chassis component coupled to the substrate and disposed proximate to the substrate to align the antenna parasitic element with the antenna feeding element, wherein the antenna feeding element and the antenna parasitic element at least partially define a gap therebetween.

14. The mobile electronic device of claim 13 wherein the antenna parasitic element is electrically coupled to the antenna feeding element over the gap.

15. The mobile electronic device of claim 13 wherein the antenna feeding element is integral to the die.

16. The mobile electronic device of claim 13 further comprising a reflector to direct radiation emitted by the feeding antenna element or antenna parasitic element.

17. The mobile electronic device of claim 13 further comprising an alignment element, wherein one or more of the antenna feeding element and the antenna parasitic element is positioned using the alignment element.

18. The mobile electronic device of claim 13 wherein one or more of the antenna feeding element and the antenna parasitic element form at least a portion of a Yagi-Uda antenna.

19. The mobile electronic device of claim 13 wherein one or more of the antenna feeding element and the antenna parasitic element form at least a portion of a millimeter wave antenna.

20. A method comprising:

providing a substrate including a die and an antenna feeding element, the antenna feeding element having a wired connection to the die;

providing a chassis component including an antenna parasitic element; and

assembling the substrate and the chassis component such that the chassis component is disposed substantially proximate to the substrate.

21. The method of claim 20, further comprising assembling the substrate and the chassis component such that the antenna parasitic element forms a spaced relationship with the antenna feeding element and the antenna feeding element and the antenna parasitic element at least partially define an gap there between.

22. The method of claim 20 further comprising providing one or more of an adhesive film or an epoxy on the chassis component whereby the antenna parasitic element is mechanically coupled to the chassis component by the one or more of the adhesive film or the epoxy.