PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME
First Claim
Patent Images
1. A printed circuit board (PCB) comprising:
- a body;
at least one leaf spring coupled to the body, anda solder layer between the body and the at least one leaf spring, the solder layer coupling the at least one leaf spring with the body.
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Abstract
A semiconductor memory device including a case including an upper case, a lower case, support structures extending from the lower case to the upper case, a printed circuit board (PCB) in the case and supported by the support structures, a leaf spring on a lower surface of the PCB, the leaf spring seated on support surfaces of the support structures, and a solder layer between the PCB and the leaf spring, the solder layer coupling the PCB with the leaf spring may be provided.
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Citations
38 Claims
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1. A printed circuit board (PCB) comprising:
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a body; at least one leaf spring coupled to the body, and a solder layer between the body and the at least one leaf spring, the solder layer coupling the at least one leaf spring with the body. - View Dependent Claims (2, 3, 4, 5, 8, 9, 10)
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6-7. -7. (canceled)
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11. A semiconductor memory device comprising:
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a case; a printed circuit board (PCB) in the case; at least one leaf spring coupled onto a lower surface of the PCB; and a solder layer between the PCB and the at least one leaf spring, the solder layer coupling the PCB with the at least one leaf spring. - View Dependent Claims (12, 18, 22)
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13-17. -17. (canceled)
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19-21. -21. (canceled)
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23-30. -30. (canceled)
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31. A semiconductor memory device comprising:
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a case including a supporting structure, the supporting structure extending from one surface of the case; a printed circuit board (PCB) in the case, the PCB including a top surface and a bottom surface, the top surface of the PCB having a semiconductor device thereon, the bottom surface of the PCB facing and supported by the support structure; a leaf spring between the bottom surface of the PCB and the support structure, the leaf spring having a first portion vertically overlapping the support structure and a second portion not vertically overlapping the support structure; and a solder layer between the PCB and the second portion of the leaf spring, the solder layer coupling the PCB with the leaf spring. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38)
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Specification