SEMICONDUCTOR WAFER AND METHOD OF BACKSIDE PROBE TESTING THROUGH OPENING IN FILM FRAME
First Claim
1. A method of making a semiconductor device, comprising:
- providing a semiconductor wafer including a non-active surface;
forming a conductive layer over the non-active surface;
providing a wafer holder;
forming a first opening through the wafer holder;
mounting the semiconductor wafer to the wafer holder with the conductive layer on the non-active surface oriented toward the wafer holder; and
probe testing the semiconductor wafer by contacting the conductive layer through the first opening in the wafer holder.
3 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor test system has a film frame including a tape portion with one or more openings through the tape portion. The opening is disposed in a center region of the tape portion of the film frame. The film frame may have conductive traces formed on or through the tape portion. A thin semiconductor wafer includes a conductive layer formed over a surface of the semiconductor wafer. The semiconductor wafer is mounted over the opening in the tape portion of the film frame. A wafer probe chuck includes a lower surface and raised surface. The film frame is mounted to the wafer probe chuck with the raised surface extending through the opening in the tape portion to contact the conductive layer of the semiconductor wafer. The semiconductor wafer is probe tested through the opening in the tape portion of the film frame.
4 Citations
20 Claims
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1. A method of making a semiconductor device, comprising:
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providing a semiconductor wafer including a non-active surface; forming a conductive layer over the non-active surface; providing a wafer holder; forming a first opening through the wafer holder; mounting the semiconductor wafer to the wafer holder with the conductive layer on the non-active surface oriented toward the wafer holder; and probe testing the semiconductor wafer by contacting the conductive layer through the first opening in the wafer holder. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of making a semiconductor device, comprising:
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providing a semiconductor wafer; providing a wafer holder; forming a first opening through the wafer holder; mounting the semiconductor wafer to the wafer holder; and probe testing the semiconductor wafer through the first opening in the wafer holder. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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- 14. An apparatus for probe testing a semiconductor wafer, comprising a wafer holder with a first opening formed through the wafer holder, wherein the semiconductor wafer is disposed over the first opening in the wafer holder to probe test the semiconductor wafer through the first opening in the wafer holder.
Specification