ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
First Claim
1. An electronic package, comprising:
- a carrier;
a plurality of electronic elements disposed on the carrier;
a barrier frame disposed on the carrier and positioned between adjacent two of the electronic elements;
an encapsulant formed on the carrier and encapsulating the electronic elements and the barrier frame with a portion of the barrier frame protruding from the encapsulant; and
a shielding element disposed on the encapsulant and being in contact with the portion of the barrier frame protruding from the encapsulant,wherein the barrier frame and the shielding element form a shielding structure.
1 Assignment
0 Petitions
Accused Products
Abstract
An electronic package is provided, which includes: a carrier; a plurality of electronic elements disposed on the carrier; a barrier frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the barrier frame with a portion of the barrier frame protruding from the encapsulant; and a shielding element disposed on the encapsulant and being in contact with the portion of the barrier frame protruding from the encapsulant. Therefore, the electronic package has an electromagnetic interference (EMI) shielding effect improved. The present disclosure further provides a method for fabricating the electronic package.
8 Citations
14 Claims
-
1. An electronic package, comprising:
-
a carrier; a plurality of electronic elements disposed on the carrier; a barrier frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the barrier frame with a portion of the barrier frame protruding from the encapsulant; and a shielding element disposed on the encapsulant and being in contact with the portion of the barrier frame protruding from the encapsulant, wherein the barrier frame and the shielding element form a shielding structure. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A method for fabricating an electronic package, comprising:
-
disposing a plurality of electronic elements and a barrier frame on a carrier with the barrier frame positioned between adjacent two of the electronic elements; forming on the carrier an encapsulant encapsulating the electronic elements and the barrier frame with a portion of the barrier frame protruding from the encapsulant; and disposing a shielding element on the encapsulant with the shielding element being in contact with the portion of the barrier frame protruding from the encapsulant. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
-
Specification