CROSSTALK SUPPRESSION IN WIRELESS TESTING OF SEMICONDUCTOR DEVICES
First Claim
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1. An apparatus, comprising:
- a wireless probe card having a plurality of wireless units, the plurality of wireless units including at least a first wireless unit and a second wireless unit;
wherein the first wireless unit is configured to wirelessly communicate with a first integrated circuit die from among a plurality of integrated circuit dies under test at a first frequency, the first integrated circuit die being integrated within a single wafer and including a radio frequency selector configured to select the first frequency for use by the first integrated circuit die from among a plurality of radio frequencies,wherein the second wireless unit is configured to wirelessly communicate with a second integrated circuit die from among the plurality of integrated circuit dies under test at a second frequency different than the first frequency, the second integrated circuit die being integrated within the single wafer and including a radio frequency selector configured to select the second frequency for use by the second integrated circuit die from among the plurality of radio frequencies.
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Abstract
An integrated circuit is fabricated on a semiconductor material die and adapted to be at least partly tested wirelessly. Circuitry for setting a selected radio communication frequency to be used for the wireless test of the integrated circuit is integrated on the semiconductor material die.
2 Citations
15 Claims
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1. An apparatus, comprising:
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a wireless probe card having a plurality of wireless units, the plurality of wireless units including at least a first wireless unit and a second wireless unit; wherein the first wireless unit is configured to wirelessly communicate with a first integrated circuit die from among a plurality of integrated circuit dies under test at a first frequency, the first integrated circuit die being integrated within a single wafer and including a radio frequency selector configured to select the first frequency for use by the first integrated circuit die from among a plurality of radio frequencies, wherein the second wireless unit is configured to wirelessly communicate with a second integrated circuit die from among the plurality of integrated circuit dies under test at a second frequency different than the first frequency, the second integrated circuit die being integrated within the single wafer and including a radio frequency selector configured to select the second frequency for use by the second integrated circuit die from among the plurality of radio frequencies. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method, comprising:
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positioning a wireless probe card in proximity to a single wafer including a plurality of integrated circuit dies under test, wherein the wireless probe card includes a plurality of wireless units, each of the plurality of wireless units operable to communicate using a different radio frequency than each other of the plurality of wireless units; programming a radio frequency selector for each integrated circuit die of the plurality of different integrated circuit dies under test to operate at a certain radio frequency, wherein the certain radio frequency matches one of the different radio frequencies used by a corresponding wireless unit of the plurality of wireless units; and engaging in communication between each wireless unit and the corresponding integrated circuit die to perform testing of the integrated circuit die. - View Dependent Claims (14, 15)
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Specification