Hexagonal Semiconductor Package Structure

• US 20180048177A1
• Filed: 08/09/2016
• Published: 02/15/2018
• Est. Priority Date: 08/09/2016
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Huang, Tzu-Sung, Yu, Chen-Hua, Tsai, Hao-Yi, Kuo, Hung-Yi, Tseng, Ming Hung
• Granted Patent: US 10,530,175 B2
• Time in Patent Office: Days
• CPC Class Codes: H01F 2017/0086 on semiconductor substrate
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01F 41/10 Connecting leads to windings making electric connections in general H01R43/00
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H02J 50/005 Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/80 involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
• CPC Class Codes: H02J 7/00034 Charger exchanging data with an electronic device, i.e. telephone, whose internal battery is under charge

Abstract

Coil structures and methods of forming are provided. The coil structure includes a substrate. A plurality of coils is disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil structure. The plurality of coils is arranged in a honeycomb pattern, and each conductive element is electrically connected to an external electrical circuit.

Claims

1. A method of forming a coil structure, comprising:

forming a first conductive element on a wafer, the first conductive element forming a first continuous spiral having a hexagonal shape in a plan view of the first conductive element;

forming a second conductive element on the wafer, the second conductive element forming a second continuous spiral having a hexagonal shape in a plan view of the second conductive element;

encapsulating the first conductive element and the second conductive element in an encapsulating material;

forming a dielectric layer overlying the encapsulating material;

forming a first plurality of electrical connectors in the dielectric layer, the first plurality of electrical connectors being electrically connected to the first conductive element; and

forming a second plurality of electrical connectors in the dielectric layer, the second plurality of electrical connectors being electrically connected to the second conductive element.

2. The method according to claim 1, further comprising singulating the first conductive element from the second conductive element using a laser grooving process.

3. The method according to claim 1, further comprising:

forming a third conductive element and a fourth conductive element in the encapsulating material, the third conductive element and the fourth conductive element respectively forming a continuous spiral having a hexagonal shape in a plan view of the third conductive element and the fourth conductive element.

4. The method according to claim 3, further comprising arranging the first conductive element, the second conductive element, the third conductive element, and the fourth conductive element in a honeycomb pattern.

5. The method according to claim 1, wherein a virtual line extends from a center point of the first continuous spiral to a center point of the second continuous spiral, and wherein the first conductive element passes over the virtual line at least three times.

6. The method according to claim 1, further comprising electrically coupling each of the first plurality of electrical connectors and each of the second plurality of electrical connectors to a circuit for charging a battery.

7. The method according to claim 1, further comprising electrically coupling each of the first plurality of electrical connectors and each of the second plurality of electrical connectors to an electrical circuit that comprises a power source and a microcontroller.

8. The method according to claim 1, further comprising:

arranging the first conductive element, the second conductive element, and a plurality of additional conductive elements on a surface, wherein each of the plurality of additional conductive elements has a hexagonal shape in a plan view of the additional conductive element;

wherein the first conductive element, the second conductive element and the plurality of additional conductive elements are arranged in a honeycomb pattern; and

wherein an area of the surface in which the first conductive element, the second conductive element and the plurality of additional conductive elements are arranged comprises over 91% of a total area of the surface.

9. A method, comprising:

forming a plurality of coils, each coil comprising a conductive element that forms a hexagonal shape in a plan view;

encapsulating each coil in an encapsulating material; and

arranging the plurality of coils on a wafer in a symmetric array.

10. The method of claim 9, wherein sidewalls of each coil are aligned with sidewalls of adjacent coils, and the symmetric array comprises a honeycomb pattern.

11. The method of claim 9, further comprising forming a first dielectric layer overlying the plurality of coils and a second dielectric layer underlying the plurality of coils.

12. The method of claim 9, further comprising forming a plurality of electrical connectors that are configured to electrically connect each conductive element in the plurality of coils to an external electrical circuit.

13. The method of claim 12, further comprising connecting each of the plurality of electrical connectors to the external electrical circuit, wherein the external electrical circuit is electrically connected to an antenna.

14. The method of claim 9, further comprising performing a laser grooving process to singulate each of the plurality of coils before arranging the coils on the wafer in the symmetric array.

15. A system, comprising:

a substrate; and

a plurality of coils disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil, wherein the plurality of coils is arranged on the substrate in a honeycomb pattern; and

a plurality of electrical connectors, wherein two or more of the plurality of the electrical connectors are disposed over each of the plurality of coils.

16. The system according to claim 15, further comprising an external electrical circuit, wherein each of the plurality of electrical connectors are electrically coupled to the external electrical circuit.

17. The system according to claim 16, wherein the external electrical circuit is electrically coupled to a power source and an antenna.

18. The system according to claim 17, wherein the external electrical circuit further comprises a microcontroller.

19. The system according to claim 16, wherein the external electrical circuit is coupled to a battery and an antenna.

20. The system according to claim 19, wherein the external electrical circuit further comprises a matching circuit and a bluetooth circuit, and the plurality of electrical connectors are electrically connected to the matching circuit.