Hexagonal Semiconductor Package Structure
First Claim
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1. A method of forming a coil structure, comprising:
- forming a first conductive element on a wafer, the first conductive element forming a first continuous spiral having a hexagonal shape in a plan view of the first conductive element;
forming a second conductive element on the wafer, the second conductive element forming a second continuous spiral having a hexagonal shape in a plan view of the second conductive element;
encapsulating the first conductive element and the second conductive element in an encapsulating material;
forming a dielectric layer overlying the encapsulating material;
forming a first plurality of electrical connectors in the dielectric layer, the first plurality of electrical connectors being electrically connected to the first conductive element; and
forming a second plurality of electrical connectors in the dielectric layer, the second plurality of electrical connectors being electrically connected to the second conductive element.
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Abstract
Coil structures and methods of forming are provided. The coil structure includes a substrate. A plurality of coils is disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil structure. The plurality of coils is arranged in a honeycomb pattern, and each conductive element is electrically connected to an external electrical circuit.
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Citations
20 Claims
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1. A method of forming a coil structure, comprising:
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forming a first conductive element on a wafer, the first conductive element forming a first continuous spiral having a hexagonal shape in a plan view of the first conductive element; forming a second conductive element on the wafer, the second conductive element forming a second continuous spiral having a hexagonal shape in a plan view of the second conductive element; encapsulating the first conductive element and the second conductive element in an encapsulating material; forming a dielectric layer overlying the encapsulating material; forming a first plurality of electrical connectors in the dielectric layer, the first plurality of electrical connectors being electrically connected to the first conductive element; and forming a second plurality of electrical connectors in the dielectric layer, the second plurality of electrical connectors being electrically connected to the second conductive element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method, comprising:
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forming a plurality of coils, each coil comprising a conductive element that forms a hexagonal shape in a plan view; encapsulating each coil in an encapsulating material; and arranging the plurality of coils on a wafer in a symmetric array. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A system, comprising:
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a substrate; and a plurality of coils disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil, wherein the plurality of coils is arranged on the substrate in a honeycomb pattern; and a plurality of electrical connectors, wherein two or more of the plurality of the electrical connectors are disposed over each of the plurality of coils. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification