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Hexagonal Semiconductor Package Structure

  • US 20180048177A1
  • Filed: 08/09/2016
  • Published: 02/15/2018
  • Est. Priority Date: 08/09/2016
  • Status: Active Grant
First Claim
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1. A method of forming a coil structure, comprising:

  • forming a first conductive element on a wafer, the first conductive element forming a first continuous spiral having a hexagonal shape in a plan view of the first conductive element;

    forming a second conductive element on the wafer, the second conductive element forming a second continuous spiral having a hexagonal shape in a plan view of the second conductive element;

    encapsulating the first conductive element and the second conductive element in an encapsulating material;

    forming a dielectric layer overlying the encapsulating material;

    forming a first plurality of electrical connectors in the dielectric layer, the first plurality of electrical connectors being electrically connected to the first conductive element; and

    forming a second plurality of electrical connectors in the dielectric layer, the second plurality of electrical connectors being electrically connected to the second conductive element.

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