COOLING DEVICE

• US 20180051936A1
• Filed: 12/25/2015
• Published: 02/22/2018
• Est. Priority Date: 12/25/2014
• Status: Active Grant

• Current Assignee: Mitsubishi Aluminum Company Limited (Mitsubishi Materials Corporation)
• Original Assignee: Mitsubishi Aluminum Company Limited (Mitsubishi Materials Corporation)
• Inventors: TAKEMURA, Hiroshi, SUEKI, Yasuhito, SATA, Shun-ichi, HISANO, Tokio
• Granted Patent: US 10,544,993 B2
• Time in Patent Office: Days
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28F 1/24 and extending transversely F28F1/38 takes precedence
• CPC Class Codes: F28F 7/02 Blocks traversed by passages for heat-exchange media F28D7/0008 takes precedence
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Providing a cooling device which can improve cooling performance though it is configured to be compact.

A cooling device 100 includes: a base block 20 having a mounting side 21a on which a heat-generating body 10 is installed along a vertical direction; a pipe unit 30 including a tank 31 buried at an opposite side 21b to the mounting side 21a of the base block 20 and storing coolant 60, and pipes 32 which are connected to the tank 31 in a state of standing at a side of the tank 31 and being parallel to each other, and heat radiation fins 40 installed on the pipes 32 in a state in which the pipes 32 penetrate the heat radiation fins 40, the cooling device in which the tank 31 is formed to have a flattened shape with a smaller thickness t2 along a thickness direction of the base block 20 than a height h2 along the vertical direction; and the pipes 32 are connected to an upper position of the tank 31.

Claims

1. A cooling device comprising

a base block having a mounting side on which at least one heat-generating body is installed along a vertical direction;

at least one pipe unit comprising a tank buried at an opposite side to the mounting side of the base block and storing coolant, and pipes which are connected to the tank in a state of standing at a side of the tank and being parallel to each other; and

heat radiation fins installed on the pipes in a state in which the pipes penetrate the heat radiation fins, wherein

the tank is formed to have a flattened shape with a smaller thickness along a thickness direction of the base block than a height along the vertical direction; and

the pipes are connected to an upper position of the tank.

2. The cooling device according to claim 1, wherein

a plurality of the at least one pipe unit is buried at the base block in parallel to each other;

an installation interval of the pipe units between the tanks is set to be smaller than a planned installation interval of the heat-generating bodies; and

the heat radiation fins are integrally provided to extend over the pipes of the pipe units.