BIPOLAR ELECTROSTATIC CHUCK AND METHOD FOR USING THE SAME

• US 20180053675A1
• Filed: 03/17/2017
• Published: 02/22/2018
• Est. Priority Date: 08/22/2016
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: WHITE, John M., RAO, Shreesha Y.
• Granted Patent: US 10,460,969 B2
• Time in Patent Office: Days
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/6776 Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Abstract

Described herein are an electrostatic chuck and method for using the same. In one example, an electrostatic chuck is provided that includes a plurality of independently replaceable electrostatic chuck assemblies mounted in an array across a chuck body. The electrostatic chuck assemblies define a substrate support surface suitable for supporting a large area substrate. At least a first electrostatic chuck assembly of the plurality of electrostatic chuck assemblies is operable independent of an operation of a second electrostatic chuck assembly of the plurality of electrostatic chuck assemblies. In yet another example, a method for chucking a substrate is provided.

Claims

1. An electrostatic chuck comprising:

a chuck body; and

a plurality of independently replaceable electrostatic chuck assemblies mounted in an array across the chuck body to define a substrate support surface suitable for supporting a large area substrate, at least a first electrostatic chuck assembly of the plurality of electrostatic chuck assemblies operable independent of an operation of a second electrostatic chuck assembly of the plurality of electrostatic chuck assemblies.

2. The electrostatic chuck of claim 1, wherein each electrostatic chuck assembly has at least two electrodes arranged in a bi-polar configuration.

3. The electrostatic chuck of claim 2, wherein the two electrodes comprise interleaving electrodes fingers.

4. The electrostatic chuck of claim 1, wherein the first electrostatic chuck assembly is laterally spaced apart from the second electrostatic chuck assembly to form a gap therebetween.

5. The electrostatic chuck of claim 4, wherein the chuck body comprises:

a port aligned with and configured to flow gas into the gap defined between the first and second electrostatic chuck assemblies.

6. The electrostatic chuck of claim 1, wherein the plurality of electrostatic chuck assemblies have gaps defined therebetween configured to flow gas across the substrate support surface.

7. The electrostatic chuck of claim 1, wherein the chuck body comprises:

conduits for flowing a heat transfer fluid within the chuck body.

8. The electrostatic chuck of claim 1 further comprising a seal circumscribing the electrostatic chuck assemblies, the seal configured to retain backside gas across the electrostatic chuck assemblies.

9. The electrostatic chuck of claim 8, wherein the seal is operable to flex away from the chuck body.

10. The electrostatic chuck of claim 8, wherein the carrier body further comprises:

a recess across which the seal is supported in a cantilevered orientation, the seal is operable to flex away from the chuck body in response to a sufficient amount of gas provided to the recess.

11. The electrostatic chuck of claim 1, wherein each electrostatic chuck assembly comprises:

a main body having at least a first electrode disposed therein; and

at least a first tab extending from the main body and through the chuck body, the first tab comprising a connection terminal coupled to the first electrode, the connection terminal sandwiched between insulating layers.

12. The electrostatic chuck of claim 11 further comprising:

a first electrical lead electrically coupled to the connection terminal disposed in the first tab, the first electrical lead separated from the main body by the carrier body.

13. The electrostatic chuck of claim 12 further comprising:

a terminal connector comprising a contact terminal encapsulated in an electrically insulating cover, a portion of the contact terminal exposed through an opening in a top surface of the cover, the top surface of the cover further comprising an outer ring disposed radially outward of the opening and an inner ring disposed radially inward of the opening.

14. The electrostatic chuck of claim 13, wherein the inner ring and the outer ring are sealingly compressed against the first tab when the exposed portion of the contact terminal is in physical and electrical contact with the connection terminal disposed in the first tab.

15. The electrostatic chuck of claim 1, wherein the chuck body is coupled to a stem.

16. The electrostatic chuck of claim 1, wherein the chuck body is adapted to be transported between processing chambers of a processing system while having a substrate secured thereto.

17. A method for chucking a substrate, comprising:

disposing a large area substrate against a substrate support surface of an electrostatic chuck comprising a plurality of independently replaceable independently energizable bi-polar electrostatic chuck assemblies;

energizing at least a first group of the bi-polar electrostatic chuck assemblies to secure the substrate to the substrate support surface;

providing a backside gas between the substrate and the substrate support surface; and

applying pressure below a seal secured in a cantilevered orientation and circumscribing the bi-polar electrostatic chuck assemblies, the pressure flexing the seal into contact with the substrate.

18. The method of claim 17 further comprising:

not applying power to at least a second group of the bi-polar electrostatic chuck assemblies while the substrate is secured to the substrate support surface by the first group;

determining at least one of the bi-polar electrostatic chuck assemblies in the first group have failed; and

energizing at least one or more of the bi-polar electrostatic chuck assemblies of the second group with the first group to secure another substrate to the electrostatic chuck.

19. The method of claim 17 further comprising:

transporting the substrate while secured to the substrate support surface out of a processing chamber.

20. The method of claim 17 further comprising:

elevating the substrate while secured to the substrate support surface within a processing chamber.