SEMICONDUCTOR SENSOR AND METHOD OF MANUFACTURING THE SAME
First Claim
1. A semiconductor sensor, comprising a gas-sensing device and an integrated circuit electrically connected to the gas-sensing device, and the gas-sensing device comprising:
- a substrate having a sensing area and an interconnection area in the vicinity of the sensing area;
an inter-metal dielectric (IMD) layer formed above the substrate in the sensing area and in the interconnection area; and
an interconnect structure formed in the interconnection area, and the interconnect structure comprising;
a tungsten layer buried in the IMD layer and part of a top surface of the tungsten layer being exposed by at least a via; and
a platinum layer formed in said at least the via,wherein the platinum (Pt) layer directly contacts said part of the top surface of the tungsten layer.
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Accused Products
Abstract
A semiconductor sensor, comprising a gas-sensing device and an integrated circuit electrically connected to the gas-sensing device, is provided. The gas-sensing device includes a substrate having a sensing area and an interconnection area in the vicinity of the sensing area, an inter-metal dielectric (IMD) layer formed above the substrate in the sensing area and in the interconnection area, and an interconnect structure formed in the interconnection area. The interconnect structure includes a tungsten layer buried in the IMD layer, wherein part of a top surface of the tungsten layer is exposed by at least a via. The interconnect structure further includes a platinum layer formed in said at least the via, wherein the platinum (Pt) layer directly contacts the top surface of the tungsten layer.
7 Citations
21 Claims
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1. A semiconductor sensor, comprising a gas-sensing device and an integrated circuit electrically connected to the gas-sensing device, and the gas-sensing device comprising:
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a substrate having a sensing area and an interconnection area in the vicinity of the sensing area; an inter-metal dielectric (IMD) layer formed above the substrate in the sensing area and in the interconnection area; and an interconnect structure formed in the interconnection area, and the interconnect structure comprising; a tungsten layer buried in the IMD layer and part of a top surface of the tungsten layer being exposed by at least a via; and a platinum layer formed in said at least the via, wherein the platinum (Pt) layer directly contacts said part of the top surface of the tungsten layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of manufacturing a semiconductor sensor, comprising forming a gas-sensing device and an integrated circuit and electrically connecting the gas-sensing device to the integrated circuit, and a method of manufacturing the gas-sensing device comprising:
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providing a substrate having a sensing area and an interconnection area in the vicinity of the sensing area; forming an inter-metal dielectric (IMD) layer above the substrate in the sensing area and in the interconnection area; and forming an interconnect structure in the interconnection area, comprising; forming a tungsten layer in the IMD layer, and part of a top surface of the tungsten layer being exposed by at least a via; and forming a platinum layer in said at least the via, wherein the platinum (Pt) layer directly contacts said part of the top surface of the tungsten layer. - View Dependent Claims (18, 19, 20, 21)
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Specification