SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- a plurality of first input/output circuits for a first channel;
a plurality of first input/output pads corresponding to the plurality of first input/output circuits, respectively, wherein the first input/output pads are aligned along and extend in a first direction;
a plurality of second input/output circuits for the first channel;
a plurality of second input/output pads corresponding to the plurality of second input/output circuits, respectively, wherein the second input/output pads are aligned along and extend in a second direction; and
an input circuit between the first input/output pads and the second input/output pads, and connected to a memory to which the input circuit performs input of data from the plurality of first input/output circuits and the plurality of second input/output circuits, wherein a first line extending perpendicular to the first direction from one of the first input/output pads and a second line extending perpendicular to the second direction from one of the second input/output pads intersect a portion of the input circuit.
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Accused Products
Abstract
A semiconductor device includes first input/output circuits for a first channel, first input/output pads corresponding to the first input/output circuits, respectively, wherein the first input/output pads are aligned along and extends in a first direction, second input/output circuits for the first channel, second input/output pads corresponding to the second input/output circuits, respectively, wherein the second input/output pads are aligned along and extends in a second direction, and an input circuit between the first input/output pads and the second input/output pads, and connected to a memory to which the input circuit inputs data from the first input/output circuits and the second input/output circuits. The input circuit is positioned such that a first line extending perpendicular to the first direction from one of the first input/output pads and a second line extending perpendicular to the second direction from one of the second input/output pads intersect a portion of the input circuit.
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Citations
20 Claims
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1. A semiconductor device comprising:
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a plurality of first input/output circuits for a first channel; a plurality of first input/output pads corresponding to the plurality of first input/output circuits, respectively, wherein the first input/output pads are aligned along and extend in a first direction; a plurality of second input/output circuits for the first channel; a plurality of second input/output pads corresponding to the plurality of second input/output circuits, respectively, wherein the second input/output pads are aligned along and extend in a second direction; and an input circuit between the first input/output pads and the second input/output pads, and connected to a memory to which the input circuit performs input of data from the plurality of first input/output circuits and the plurality of second input/output circuits, wherein a first line extending perpendicular to the first direction from one of the first input/output pads and a second line extending perpendicular to the second direction from one of the second input/output pads intersect a portion of the input circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor device capable of transmitting and receiving a signal to and from a memory device, the semiconductor device comprising:
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a plurality of first input/output pads that are associated with a first channel provided between the first input/output pads and the memory device and arranged in a first row; a plurality of second input/output pads that are associated with the first channel and arranged in a second row; and an input circuit between the first and second rows and connected to the memory device to which the input circuit performs input of data received through the first and second input/output pads, wherein at least two of the first input/output pads are spaced from the input circuit by substantially the same distance and at least two of the second input/output pads are spaced from the input circuit by substantially the same distance. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A semiconductor device comprising:
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a plurality of memory chips, each including a substrate and electrodes penetrating the substrate and formed with memory devices connected to the electrodes; and an interface chip configured to transmit and receive data to and from the plurality of memory devices via the electrodes of the memory chips, wherein the plurality of memory chips includes a first memory chip stacked on the interface chip and a second memory chip stacked on the first memory chip, and the interface chip includes; a plurality of first input/output pads that are associated with a first channel provided between the first input/output pads and the memory chips and arranged in a first row; a plurality of second input/output pads that are associated with the first channel and arranged in a second row; and an input circuit between the first and second rows and connected to the memory chips to which the input circuit performs input of data received through the first and second input/output pads, wherein at least two of the first input/output pads are spaced from the input circuit by substantially the same distance and at least two of the second input/output pads are spaced from the input circuit by substantially the same distance. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification