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Fabrication Of Thin-Film Encapsulation Layer For Light Emitting Device

  • US 20180061719A1
  • Filed: 11/02/2017
  • Published: 03/01/2018
  • Est. Priority Date: 12/12/2013
  • Status: Active Grant
First Claim
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1. An apparatus for fabricating a layer for an electronic device having one or more light emitting elements, the layer to have a desired thickness, the apparatus comprising:

  • an ink jet printer to receive a substrate, the one or more light emitting elements formed on the substrate, and to print droplets of an organic material onto the substrate, in a manner so as to form a liquid coat over the one or more light emitting elements;

    circuitry to control the volume of the liquid printed per unit area of the substrate in dependence on the desired thickness by causing the ink jet printer to vary at least one of a droplet area density or a size of the droplets, in a manner such that a thicker liquid coat is formed by a greater droplet area density or size and a thinner liquid coat is formed by a lesser droplet area density or size, and in a manner where at least one value dependent on the desired thickness is received by the circuitry and used by the circuitry to specify thickness of the liquid coat as deposited; and

    a processing mechanism to process the liquid coat once deposited to form the layer from the liquid coat so as to have the desired thickness.

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